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AM3892 Datasheet(PDF) 229 Page - Texas Instruments |
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AM3892 Datasheet(HTML) 229 Page - Texas Instruments |
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229 / 299 page  AM3894 AM3892 www.ti.com SPRS681A – OCTOBER 2010 – REVISED MARCH 2011 Table 8-62. TMDS Routing Specifications PARAMETER MIN TYP MAX UNIT MPU-to-HDMI header trace length 7000 Mils Number of stubs allowed on TMDS traces 0 Stubs TX/RX pair differential impedance 90 100 110 Ω TX/RX single ended impedance 54 60 66 Ω Number of vias on each TMDS trace 2 Vias(1) TMDS differential pair to any other trace spacing 2*DS(2) (1) Vias must be used in pairs with their distance minimized. (2) DS = differential spacing of the HDMI traces. 8.9.1.3 DDC Signals As shown in Figure 8-67, the DDC connects just like a standard I2C bus. As such, resistor pullups must be used to pull up the open drain buffer signals unless they are integrated into the ESD protection chip used. If used, these pullup resistors should be connected to a 3.3-V supply. 8.9.1.4 HDMI ESD Protection Device (Required) Interfaces that connect to a cable such as HDMI generally require more ESD protection than can be built into the processor's outputs. Therefore, this HDMI interface requires the use of an ESD protection chip to provide adequate ESD protection and to translate I2C voltage levels from the 3.3 V supplied by the device to the 5 volts required by the HDMI specification. When selecting an ESD protection chip, choose the lowest capacitance ESD protection available to minimize signal degradation. In no case should the ESD protection circuit capacitance be more than 5 pF. TI manufactures devices that provide ESD protection for HDMI signals such as the TPD12S521. For more information see the www.ti.com website. 8.9.1.5 PCB Stackup Specifications Table 8-63 shows the stackup and feature sizes required for HDMI. Table 8-63. HDMI PCB Stackup Specifications PARAMETER MIN TYP MAX UNIT PCB routing/plane layers 4 6 - Layers Signal routing layers 2 3 - Layers Number of ground plane cuts allowed within HDMI routing region - - 0 Cuts Number of layers between HDMI routing region and reference ground plane - - 0 Layers PCB trace width - 4 - Mils PCB BGA escape via pad size - 20 - Mils PCB BGA escape via hole size - 10 Mils MPU device BGA pad size(1)(2) 0.4 mm (1) Non-solder mask defined pad. (2) Per IPC-7351A BGA pad size guideline. Copyright © 2010–2011, Texas Instruments Incorporated Peripheral Information and Timings 229 Submit Documentation Feedback Product Folder Link(s): AM3894 AM3892 |
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