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AM3892 Datasheet(PDF) 296 Page - Texas Instruments |
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AM3892 Datasheet(HTML) 296 Page - Texas Instruments |
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296 / 299 page  AM3894 AM3892 SPRS681A – OCTOBER 2010 – REVISED MARCH 2011 www.ti.com 10 Mechanical Packaging and Orderable Information Table 10-1 shows the thermal resistance characteristics for the PBGA–CYG mechanical package. 10.1 Thermal Data for CYG Table 10-1. Thermal Resistance Characteristics (PBGA Package) [CYG] NO. °C/W(1) 1 R ΘJC Junction-to-case 0.21 2 R ΘJB Junction-to-board 3.93 (1) For proper device operation, a heatsink is required. 10.2 Packaging Information The following packaging information and addendum reflect the most current data available for the designated device(s). This data is subject to change without notice and without revision of this document. 296 Mechanical Packaging and Orderable Information Copyright © 2010–2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AM3894 AM3892 |
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