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ADSP-BF607 Datasheet(PDF) 101 Page - Analog Devices |
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ADSP-BF607 Datasheet(HTML) 101 Page - Analog Devices |
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101 / 112 page ![]() Rev. 0 | Page 101 of 112 | June 2013 ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 ENVIRONMENTAL CONDITIONS To determine the junction temperature on the application printed circuit board use: where: TJ = Junction temperature (°C) TCASE = Case temperature (°C) measured by customer at top center of package. JT = From Table 68 PD = Power dissipation (see Total Internal Power Dissipation on Page 56 for the method to calculate PD) Values of JA are provided for package comparison and printed circuit board design considerations. JA can be used for a first order approximation of TJ by the equation: where: TA = Ambient temperature (°C) Values of JC are provided for package comparison and printed circuit board design considerations when an external heat sink is required. In Table 68, airflow measurements comply with JEDEC stan- dards JESD51-2 and JESD51-6. The junction-to-case measurement complies with MIL-STD-883 (Method 1012.1). All measurements use a 2S2P JEDEC test board. Figure 62. Driver Type A Typical Rise and Fall Times (10%-90%) vs. Load Capacitance (VDD_EXT = 3.3 V) Figure 63. Driver Type B & C Typical Rise and Fall Times (10%-90%) vs. Load Capacitance (VDD_DMC = 1.8 V) LOAD CAPACITANCE (pF) 12 0 14 8 4 2 6 10 0 250 200 50 100 150 16 t RISE t FALL t FALL = 3.3V @ 25°C t RISE = 3.3V @ 25°C LOAD CAPACITANCE (pF) 1.2 0 1.4 0.8 0.4 0.2 0.6 1.0 025 20 510 15 t FALL = 1.8V @ 25°C t RISE = 1.8V @ 25°C 35 30 t RISE DS = 10 t FALL DS = 10 t RISE DS = 00 t FALL DS = 00 Table 68. Thermal Characteristics Parameter Condition Typical Unit JA 0 linear m/s air flow 16.7 °C/W JMA 1 linear m/s air flow 14.6 °C/W JMA 2 linear m/s air flow 13.9 °C/W JC 4.41 °C/W JT 0 linear m/s air flow 0.11 °C/W JT 1 linear m/s air flow 0.24 °C/W JT 2 linear m/s air flow 0.25 °C/W TJ TCASE JT PD + = TJ TA JA PD + = |
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