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AM3874 Datasheet(PDF) 357 Page - Texas Instruments |
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AM3874 Datasheet(HTML) 357 Page - Texas Instruments |
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357 / 361 page ![]() AM3874, AM3871 www.ti.com SPRS695C – SEPTEMBER 2011 – REVISED DECEMBER 2013 10 Mechanical The device package has been specially engineered with a new technology called Via Channel™. The Via Channel technology allows larger than normal PCB via sizes and reduced PCB signal layers to be used in a PCB design with this 0.8-mm pitch package, and will substantially reduce PCB costs. Via Channel also allows PCB routing in only two signal layers (four layers total) due to the increased layer efficiency of the Via Channel™ BGA technology. 10.1 Thermal Data for CYE-04 (Top Hat) Table 10-1. Thermal Resistance Characteristics (PBGA Package) [CYE-04] (Thinner Top Hat) NO. °C/W(1) AIR FLOW (m/s)(2) 1 R ΘJC Junction-to-case 0.39 N/A 2 R ΘJB Junction-to-board 3.87 N/A 3 R ΘJA Junction-to-free air 11.67 0.00 5 8.59 1.00 6 R ΘJMA Junction-to-moving air 7.80 2.00 7 7.33 3.00 8 0.19 0.00 10 0.20 1.00 PsiJT Junction-to-package top 11 0.20 2.00 12 0.21 3.00 13 3.44 0.00 15 3.37 1.00 PsiJB Junction-to-board 16 3.26 2.00 17 3.17 3.00 (1) These measurements were conducted in a JEDEC defined 2S2P system (with the exception of the Theta JC [R ΘJC] measurement, which was conducted in a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Packages Power dissipation of 2 W and an ambient temperature of 70ºC is assumed. (2) m/s = meters per second 10.2 Packaging Information The following packaging information and addendum reflect the most current data available for the designated device(s). This data is subject to change without notice and without revision of this document. Copyright © 2011–2013, Texas Instruments Incorporated Mechanical 357 Submit Documentation Feedback Product Folder Links: AM3874 AM3871 |
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