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AM3874 Datasheet(PDF) 357 Page - Texas Instruments

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Part # AM3874
Description  AM387x Sitara??ARM Processors
PDF  361 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

AM3874 Datasheet(HTML) 357 Page - Texas Instruments

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AM3874, AM3871
www.ti.com
SPRS695C – SEPTEMBER 2011 – REVISED DECEMBER 2013
10 Mechanical
The device package has been specially engineered with a new technology called Via Channel™. The Via
Channel technology allows larger than normal PCB via sizes and reduced PCB signal layers to be used in
a PCB design with this 0.8-mm pitch package, and will substantially reduce PCB costs. Via Channel also
allows PCB routing in only two signal layers (four layers total) due to the increased layer efficiency of the
Via Channel™ BGA technology.
10.1 Thermal Data for CYE-04 (Top Hat)
Table 10-1. Thermal Resistance Characteristics (PBGA Package) [CYE-04] (Thinner Top Hat)
NO.
°C/W(1)
AIR FLOW (m/s)(2)
1
R
ΘJC
Junction-to-case
0.39
N/A
2
R
ΘJB
Junction-to-board
3.87
N/A
3
R
ΘJA
Junction-to-free air
11.67
0.00
5
8.59
1.00
6
R
ΘJMA
Junction-to-moving air
7.80
2.00
7
7.33
3.00
8
0.19
0.00
10
0.20
1.00
PsiJT
Junction-to-package top
11
0.20
2.00
12
0.21
3.00
13
3.44
0.00
15
3.37
1.00
PsiJB
Junction-to-board
16
3.26
2.00
17
3.17
3.00
(1)
These measurements were conducted in a JEDEC defined 2S2P system (with the exception of the Theta JC [R
ΘJC] measurement,
which was conducted in a JEDEC defined 1S0P system) and will change based on environment as well as application. For more
information, see these EIA/JEDEC standards:
•
JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
•
JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-9, Test Boards for Area Array Surface Mount Packages
Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.
(2)
m/s = meters per second
10.2 Packaging Information
The following packaging information and addendum reflect the most current data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
Copyright © 2011–2013, Texas Instruments Incorporated
Mechanical
357
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Product Folder Links: AM3874 AM3871



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