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TMS55166 Datasheet(PDF) 37 Page - Texas Instruments

Part # TMS55166
Description  262144 BY 16-BIT MULTIPORT VIDEO RAM
PDF  70 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TMS55166 Datasheet(HTML) 37 Page - Texas Instruments

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TMS55165, TMS55166, TMS55175, TMS55176
262144 BY 16-BIT MULTIPORT VIDEO RAM
SMVS463 – DECEMBER 1995
37
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
timing requirements over recommended ranges of supply voltage and operating free-air
temperature (continued)†
ALT.
’551xx -60
’551xx - 70
UNIT
SYMBOL
MIN
MAX
MIN
MAX
UNIT
th(CLW)
Hold time, first WEx low after CAS low, early write
tWCH
10
15
ns
th(RA)
Hold time, row address after RAS low
tRAH
10
10
ns
th(RDQ)
Hold time, write mask valid after RAS low, non-persistent write-per-bit
tMH
10
10
ns
th(RHrd)
Hold time, both WEx high after RAS high, read (see Note 12)
tRRH
0
0
ns
th(RLCA)
Hold time, column address valid after RAS low (see Note 13)
tAR
30
30
ns
th(RLD)
Hold time, data valid after RAS low (see Note 13)
tDHR
35
35
ns
th(RLW)
Hold time, WEx low after RAS low, write
tWCR
30
35
ns
th(RSF)
Hold time, DSF after RAS low
tFHR
30
35
ns
th(RWM)
Hold time, WEx low after RAS low, write-per-bit
tRWH
10
10
ns
th(SFC)
Hold time, DSF after CAS low
tCFH
10
10
ns
th(SFR)
Hold time, DSF after RAS low
tRFH
10
10
ns
th(SHSQ)
Hold time, SQ after SC high
tSOH
4
5
ns
th(TRG)
Hold time, TRG after RAS low
tTHH
10
10
ns
th(WLD)
Hold time, data valid after first WEx low, late write
tDH
15
15
ns
th(WLG)
Hold time, TRG high after WEx low (see Note 14)
tOEH
10
10
ns
td(CACH)
Delay time, column address valid to CAS going high
tCAL
30
45
ns
td(CAGH)
Delay time, column address to TRG high in real-time-load and late-load
full-register transfer
tATH
20
20
ns
td(CARH)
Delay time, column address valid to RAS high
tRAL
30
35
ns
td(CASH)
Delay time, column address to first SC high after TRG high, early-load
full-register transfer
tASD
25
25
ns
td(CAWL)
Delay time, column address valid to first WEx low, read-modify-write
tAWD
50
60
ns
td(CHRL)
Delay time, CAS high to RAS low
tCRP
0
0
ns
td(CLGH)
Delay time, CAS low to TRG high, read
17
20
ns
td(CLQSF)
Delay time, CAS low to QSF switching, full-register transfer
(see Note 15)
tCQD
30
30
ns
td(CLRH)
Delay time, CAS low to RAS going high
tRSH
17
20
ns
td(CLRL)
Delay time, CAS low to RAS low, CBR refresh
tCSR
0
0
ns
td(CLSH)
Delay time, CAS low to first SC high after TRG high, early-load
full-register transfer
tCSD
20
20
ns
td(CLTH)
Delay time, CAS low to TRG high, real-time-load and late-load
full-register transfer
tCTH
15
15
ns
td(CLWL)
Delay time, CAS low to first WEx low, read-modify-write (see Note 16)
tCWD
37
45
ns
td(CLZ)
Delay time, CAS low to DQ in the low-impedance state
tCLZ
3
2
ns
td(DCL)
Delay time, data to CAS low
tDZC
0
0
ns
td(DGL)
Delay time, data to TRG low
tDZO
0
0
ns
td(GHD)
Delay time, TRG high before data applied at DQ
tOED
10
15
ns
† Timing measurements are referenced to VIL max and VIH min.
NOTES: 12. Either th(RHrd) or th(CHrd) must be satisfied for a read cycle.
13. The minimum value is measured when td(RLCL) is set to td(RLCL) min as a reference.
14. Output-enable-controlled write. Output remains in the high-impedance state for the entire cycle.
15. TRG must disable the output buffers prior to applying data to the DQ pins.
16. Switching times for QSF output are measured with a load equivalent to 1 TTL load and 30 pF, and output reference level is
VOH / VOL = 2 V/0.8 V.



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