LX256VCF2085 datasheet(22/72 Pages) LATTICE

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Lattice Semiconductor

ispGDX2 Family Data Sheet

Absolute Maximum Ratings

1, 2, 3

ispGDX2C (1.8V)

ispGDX2B/V (2.5/3.3V)

Supply Voltage VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 2.5V . . . . . . . . . . . . . . . . -0.5 to 5.5V

PLL Supply Voltage VCCP. . . . . . . . . . . . . . . . . . . . -0.5 to 2.5V . . . . . . . . . . . . . . . . -0.5 to 5.5V

Output Supply Voltage VCCO . . . . . . . . . . . . . . . . . -0.5 to 4.5V . . . . . . . . . . . . . . . . -0.5 to 4.5V

JTAG Supply Voltage (VCCJ) . . . . . . . . . . . . . . . . . -0.5 to 4.5V . . . . . . . . . . . . . . . . -0.5 to 4.5V

Input or I/O Tristate Voltage Applied

4, 5 . . . . . . . . . -0.5 to 5.5V . . . . . . . . . . . . . . . . -0.5 to 5.5V

Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . -65 to 150°C . . . . . . . . . . . . . . . -65 to 150°C

Junction Temp. (TJ) with Power Applied . . . . . . . . -55 to 150°C . . . . . . . . . . . . . . . -55 to 150°C

1. Stress above those listed under the Absolute Maximum Ratings may cause permanent damage to the device. Functional operation of the

device at these or any other conditions above those indicated in the operational sections of this speciﬁcation is not implied (while program-

ming, following the programming speciﬁcations).

2. Compliance with the Lattice Thermal Management document is required.

3. All voltages referenced to GND.

4. Overshoot and undershoot of -2V to (VIH (MAX)+2) volts is permitted for a duration of <20ns.

5. A maximum of 64 I/Os per device with VIN > 3.6V is allowed.

Recommended Operating Conditions

Erase Reprogram Speciﬁcations

Hot Socketing Speciﬁcations

1, 2, 3

Symbol

Parameter

Min.

Max.

Units

VCC

Supply Voltage for 1.8V Devices

1.65

1.95

Supply Voltage for 2.5V Devices

2.3

2.7

Supply Voltage for 3.3V Devices

3.6

VCCP

Supply Voltage for PLL and sysHSI Blocks, 1.8V Devices

1.65

1.95

Supply Voltage for PLL and sysHSI Blocks, 2.5V Devices

2.3

2.7

Supply Voltage for PLL and sysHSI Blocks, 3.3V Devices

3.6

VCCJ

Power Supply Voltage for JTAG Programming 1.8V Operation

1.65

1.95

Power Supply Voltage for JTAG Programming 2.5V Operation

2.3

2.7

Power Supply Voltage for JTAG Programming 3.3V Operation

3.6

TJ (COM)

Junction Commercial Operation

°C

TJ (IND)

Junction Industrial Operation

-40

105

°C

1. sysHSI speciﬁcation is valid for VCC and VCCP = 1.7V to 1.9V.

Parameter

Min

Max

Units

Erase/Reprogram Cycle

1,000

—

Cycles

Note: Valid over commercial temperature range.

Symbol

Parameter

Condition

Min

Typ

Max

Units

IDK

Input or Tristated I/O Leakage Current

0 ≤ VIN ≤ 3.0V

—

+/-50

+/-800

μA

1. Insensitive to sequence of VCC and VCCO. However, assumes monotonic rise/fall rates for VCC and VCCO, provided (VIN - VCCO) ≤ 3.6V.

2. LVTTL, LVCMOS only.

3. 0 < VCC ≤ VCC (MAX), 0 < VCCO ≤ VCCO (MAX).

4. IDK is additive to IPU, IPD or IBH. Device defaults to pull-up until fuse circuitry is active.

LX256VCF2085 Datasheet(PDF) 22 Page - Lattice Semiconductor

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