AM3892 datasheet(122/299 Pages) TI

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AM3894

AM3892

SPRS681A – OCTOBER 2010 – REVISED MARCH 2011

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6.3

Electrical Characteristics Over Recommended Ranges of Supply Voltage and

Operating Temperature (Unless Otherwise Noted)

(1)

PARAMETER

TEST CONDITIONS(2)

MIN

TYP

MAX

UNIT

Low/full speed: USB_DN

2.8

VDD_USBx_3P3

and USB_DP

High speed: USB_DN and

360

440

VOH

USB_DP

High-level output voltage

DVDD_3P3 = MIN,

2.4

(3.3-V I/O)

IOH = MAX

Low/full speed: USB_DN

0.0

0.3

and USB_DP

High speed: USB_DN and

-10

USB_DP

VOL

Low-level output voltage

DVDD_3P3 = MIN,

0.4

(3.3-V I/O except I2C pins)

IOL = MAX

Low-level output voltage

IO = 3 mA

0.4

(3.3-V I/O I2C pins)

VI = VSS to DVDD_3P3

±1

µA

without opposing

internal resistor

VI = VSS to DVDD_3P3

100

µA

Input current [DC]

with opposing internal

(except I2C pins)

(3)

pullup resistor(4)

VI = VSS to DVDD_3P3

-100

µA

with opposing internal

pulldown resistor(4)

Input current [DC] (I2C)

VI = VSS to DVDD_3P3

±20

µA

VO = DVDD_3P3 or

±5

µA

VSS; internal pull

disabled

IOZ

(5)

I/O Off-state output current

VO = DVDD_3P3 or

±100

µA

VSS; internal pull

enabled

Core (CVDD, CVDDC) CDD

TBD

ICDD

supply current(6)

3.3-V I/O (DVDD_3P3,

TBD

USB_VDDA3P3) supply

current(6)

1.8-V I/O (DVDD1P8,

TBD

IDDD

DVDD_DDRx) supply

current(6)(7)

1.5-V I/O (DVDD_DDRx)

TBD

supply current(6)(7)

Input capacitance

2.8

Output capacitance

2.8

(1)

Data in this table is based on device operation at 1.0 GHz for the ARM Cortex-A8.

(2)

For test conditions shown as MIN, MAX, or TYP, use the appropriate value specified in the recommended operating conditions table.

(3)

II applies to input-only pins and bi-directional pins. For input-only pins, II indicates the input leakage current. For bi-directional pins, II

indicates the input leakage current and off-state (Hi-Z) output leakage current.

(4)

Applies only to pins with an internal pullup (IPU) or pulldown (IPD) resistor.

(5)

IOZ applies to output-only pins, indicating off-state (Hi-Z) output leakage current.

(6)

Measured under the following conditions: TBD. The actual current draw varies across manufacturing processes and is highly

application-dependent.

(7)

For supply voltage pins, DVDD_DDRx:

•

1.5 V is used for DDR3 SDRAM.

•

1.8 V is used for DDR2 SDRAM.

122

Device Operating Conditions

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