AM3892 datasheet(119/299 Pages) TI

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AM3894

AM3892

www.ti.com

SPRS681A – OCTOBER 2010 – REVISED MARCH 2011

Device Operating Conditions

6.1

Absolute Maximum Ratings Over Operating Case Temperature Range

(Unless Otherwise Noted)

(1) (2) (3)

MIN

MAX

UNIT

USB PHYs, 0.9 V (VDD_USB_0P9)

-0.3

1.35

Core (CVDD, CVDDC, VDDT_SATA,

-0.3

1.2

VDDT_PCIE, VDDA_HDMI,

VDDA_HD_1P0, VDDA_SD_1P0)

I/O, 1.5 V (VDDA_PLL, VDDR_SATA,

-0.3

2.45

VDDR_PCIE, DVDD_DDR0,

Steady State Supply voltage

DVDD_DDR1)(4)

ranges:

I/O, 1.8 V (DVDD1P8,

-0.3

2.45

DEVOSC_DVDD18, VDD_USB0_1P8,

VDD_USB1_1P8, VDDA_REF_1P8,

VDDA_HD_1P8, VDDA_SD_1P8,

DVDD_DDR0, DVDD_DDR1)(4)

I/O, 3.3 V (DVDD_3P3,

3.8

VDD_USB0_3P3, VDD_USB1_3P3)

V I/O, 1.5-V pins

-0.3

2.45

-0.3

DVDD_DDRx + 0.3(4)

V I/O, 1.8-V pins

-0.3

2.45

-0.3

DVDD1P8 + 0.3

-0.3

DVDD_DDRx + 0.3(4)

Input and Output voltage ranges:

V I/O, 3.3-V pins

-0.3

3.8

(Steady State)

-0.3

DVDD_3P3 + 0.3

V I/O, 3.3-V pins

20% of DVDD_3P3 for up to 20% of the

(Transient Overshoot/Undershoot)

signal period

Operating junction temperature

(default)

°C

range, TJ:

(5)

Operating case temperature

(default)

°C

range, Tc:

(5)

Storage temperature range, Tstg: (default)

-55

150

°C

HBM (Human Body Model)(7)

±2000

ESD stress voltage, VESD:

(6)

CDM (Charged-Device Model)(8)

±500

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to VSS.

(3)

Data in this table is based on device operation at 1.0 GHz for the ARM Cortex-A8.

(4)

For supply voltage pins, DVDD_DDRx:

•

1.5 V is used for DDR3 SDRAM.

•

1.8 V is used for DDR2 SDRAM.

(5)

A heat dissipation solution is required for proper device operation. Thermal performance of the overall system must be carefully

considered to ensure conformance with the recommended operating conditions. Heat generated by this device must be removed with

the help of heat sinks, heat spreaders, and/or airflow. SmartReflex can significantly lower the power consumption of this device and its

use is required for proper device operation.

(6)

Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by electrostatic discharges into the device.

(7)

Level listed above is the passing level per ANSI/ESDA/JEDEC JS-001-2010. JEDEC document JEP155 states that 500 V HBM allows

safe manufacturing with a standard ESD control process, and manufacturing with less than 500 V HBM is possible if necessary

precautions are taken. Pins listed as 2000 V may actually have higher performance.

(8)

Level listed above is the passing level per EIA-JEDEC JESD22-C101E. JEDEC document JEP157 states that 250 V CDM allows safe

manufacturing with a standard ESD control process. Pins listed as 500 V may actually have higher performance.

Device Operating Conditions

119

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