OR3C80 datasheet(195/210 Pages) AGERE

195 / 210 page

Lucent Technologies Inc.

195

Data Sheet

June 1999

ORCA Series 3C and 3T FPGAs

Package Thermal Characteristics (continued)

FPGA Maximum Junction Temperature

Once the power dissipated by the FPGA has been determined (see the Estimating Power Dissipation section), the

maximum junction temperature of the FPGA can be found. This is needed to determine if speed derating of the

device from the 85 °C junction temperature used in all of the delay tables is needed. Using the maximum ambient

temperature, TAmax, and the power dissipated by the device, Q (expressed in °C), the maximum junction tempera-

ture is approximated by:

TJmax = TAmax + (Q •

ΘJA)

Table 76 lists the plastic package thermal characteristics for the

ORCA Series FPGAs.

Table 76. Plastic Package Thermal Characteristics for the

ORCA Series1

1. Mounted on 4-layer JEDEC standard test board with two power/ground planes.

2. With thermal balls connected to board ground plane.

3. Without thermal balls connected to board ground plane.

Package

ΘJA (°C/W)

TA = 70 °C max

TJ = 125 °C max

@ 0 fpm (W)

0 fpm

200 fpm

500 fpm

208-Pin SQFP1

26.5

23.0

21.0

2.1

208-Pin SQFP21

12.8

10.3

9.1

4.3

240-Pin SQFP1

25.5

22.5

21.0

2.2

240-Pin SQFP21

13.0

10.0

9.0

4.2

256-Pin PBGA1, 2

22.5

19.0

17.5

2.4

256-Pin PBGA1, 3

26.0

22.0

20.5

2.1

352-Pin PBGA1, 2

19.0

16.0

15.0

2.9

352-Pin PBGA1, 3

25.5

22.0

20.5

2.1

432-Pin EBGA1

11.0

8.5

7.5

5.0

600-Pin EBGA1

11.0

8.5

7.5

5.5

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