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OR3C80 Datasheet(PDF) 201 Page - Agere Systems |
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OR3C80 Datasheet(HTML) 201 Page - Agere Systems |
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201 / 210 page ![]() Lucent Technologies Inc. 201 Data Sheet June 1999 ORCA Series 3C and 3T FPGAs Package Outline Diagrams (continued) 240-Pin SQFP2 Dimensions are in millimeters. DETAIL C (SQFP2 CHIP-UP) 5-3825(F).a 0.50/0.75 GAGE PLANE SEATING PLANE 1.30 REF 0.25 DETAIL A DETAIL B 0.17/0.27 0.10 M 0.090/0.200 CHIP CHIP BONDED FACE UP COPPER HEAT SINK 0.08 3.40 ± 0.20 SEATING PLANE 0.25 MIN 0.50 TYP DETAIL A DETAIL B 180 121 181 240 34.60 ± 0.20 1 32.00 ± 0.20 60 61 120 PIN #1 IDENTI FIER ZONE 32.00 ± 0.20 34.60 ± 0.20 EXPOSED HEAT SINK APPEARS ON BOTTOM SURFACE: CHIP BONDED FACE UP. (SEE DETAIL C.) 24.2 REF 24. 2 REF 4.10 MAX |
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