147 / 148 page
Ordering Guide
September 5, 2002
Document #: 38-12010 CY Rev. ** CMS Rev. 3.20
147
15.0 Ordering Guide
Table 122:
Ordering Guide
Type
Ordering Code
Flash
(KBytes)
RAM
(Bytes)
SMP
Temperature
Range
8 Pin (300 Mil) Molded DIP
CY8C25122-24PI
4
256
No
Ind. -40C to +85C
20 Pin (300 Mil) Molded DIP
CY8C26233-24PI
8
256
Yes
Ind. -40C to +85C
20 Pin (300 Mil) Molded SOIC
CY8C26233-24SI
8
256
Yes
Ind. -40C to +85C
20 Pin (210 Mil) Shrunk Small Outline
Package
CY8C26233-24PVI
8
256
Yes
Ind. -40C to +85C
28 Pin (300 Mil) Molded DIP
CY8C26443-24PI
16
256
Yes
Ind. -40C to +85C
28 Pin (300 Mil) Molded SOIC
CY8C26443-24SI
16
256
Yes
Ind. -40C to +85C
28 Pin (210 Mil) Shrunk Small Outline
Package
CY8C26443-24PVI
16
256
Yes
Ind. -40C to +85C
48 Pin (600 Mil) Molded DIP
CY8C26643-24PI
16
256
Yes
Ind. -40C to +85C
48 Pin (300 Mil) Shrunk Small Outline
Package
CY8C26643-24PVI
16
256
Yes
Ind. -40C to +85C
44 Pin Thin Plastic Quad Flatpack
CY8C26643-24AI
16
256
Yes
Ind. -40C to +85C
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