iCE40 LP/HX Family

Data Sheet

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FPGA-DS-02029-3.5

43

5.3. iCE40 LP/HX Part Number Description

5.3.1. Ultra Low Power (LP) Devices

ICE40LPXXX – XXXXXXX

Series

LP = Low Power Series

Logic Cells

384 = 384 Logic Cells

640 = 640 Logic Cells

1K = 1,280 Logic Cells

4K = 3,520 Logic Cells

8K = 7,680 Logic Cells

Package

SWG16 = 16-Ball WLCSP (0.35 mm Pitch)

CM36 = 36-Ball ucBGA (0.4 mm Pitch)

CM49 = 49-Ball ucBGA (0.4 mm Pitch)

CM81 = 81-Ball ucBGA (0.4 mm Pitch)

CB81 = 81-Ball csBGA (0.5 mm Pitch)

CM121 = 121-Ball ucBGA (0.4 mm Pitch)

CB121 = 121-Ball csBGA (0.5 mm Pitch)

CM225 = 225-Ball ucBGA (0.4 mm Pitch)

SG32 = 32-Pin QFN (0.5 mm Pitch)

QN84 = 84-Pin QFN (0.5 mm Pitch)

Device Family

iCE40 FPGA

Shipping Method

TR = Tape and Reel

TR50 = Tape and Reel 50 units

TR1K = Tape and Reel 1,000 units

Figure 5.1. Low Power (LP) Devices

5.3.2. High Performance (HX) Devices

ICE40HXXX – XXXXXXX

Series

HX = High Performance Series

Logic Cells

1K = 1,280 Logic Cells

4K = 3,520 Logic Cells

8K = 7,680 Logic Cells

Package

CB132 = 132-Ball csBGA (0.5 mm Pitch)

CM225 = 225-Ball ucBGA (0.4 mm Pitch)

CT256 = 256-Ball caBGA (0.8 mm Pitch)

TQ144 = 144-Pin TQFP (0.5 mm Pitch)

VQ100 = 100-Pin VQFP (0.5 mm Pitch)

BG121 = 121-Ball caBGA (0.8 mm Pitch)

Device Family

iCE40 Mobile FPGA

Shipping Method

TR = Tape and Reel

Figure 5.2. High Performance (HX) Devices

Note: All parts shipped in trays unless noted.