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ICE40 Datasheet(PDF) 21 Page - Lattice Semiconductor

Part # ICE40
Description  iCE40 LP/HX Family
PDF  52 Pages
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Manufacturer  LATTICE [Lattice Semiconductor]
Direct Link  http://www.latticesemi.com
Logo LATTICE - Lattice Semiconductor

ICE40 Datasheet(HTML) 21 Page - Lattice Semiconductor

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iCE40 LP/HX Family
Data Sheet
© 2011-2018 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-DS-02029-3.5
21
4.6. DC Electrical Characteristics
Over recommended operating conditions.
Table 4.5. DC Electrical Characteristics
Symbol
Parameter
Condition
Min
Typ
Max
Unit
IIL, IIH1, 3, 4, 5, 6, 7
Input or I/O Leakage
0 V < VIN < VCCIO + 0.2 V
±10
µA
C16, 7
I/O Capacitance2
VCCIO = 3.3 V, 2.5 V, 1.8 V
VCC = Typ, VIO = 0 to VCCIO + 0.2 V
6
pf
C26, 7
Global Input Buffer
Capacitance2
VCCIO = 3.3 V, 2.5 V, 1.8 V
VCC = Typ, VIO = 0 to VCCIO + 0.2 V
6
pf
VHYST
Input Hysteresis
VCCIO = 1.8 V, 2.5 V, 3.3 V
200
mV
IPU6, 7
Internal PIO Pull-up
VCCIO = 1.8 V, 0 ≤ VIN ≤ 0.65 * VCCIO
−3
−31
µA
VCCIO = 2.5 V, 0 ≤ VIN ≤ 0.65 * VCCIO
−8
−72
µA
VCCIO = 3.3 V, 0 ≤ VIN ≤ 0.65 * VCCIO
−11
−128
µA
Notes:
1.
Input or I/O leakage current is measured with the pin configured as an input or as an I/O with the output driver tri-stated. It is
not measured with the output driver active. Internal pull-up resistors are disabled.
2.
TJ 25
oC, f = 1.0 MHz.
3.
Refer to VIL and VIH in the sysI/O Single-Ended DC Electrical Characteristics table.
4.
Only applies to I/Os in the SPI bank following configuration.
5.
Some products are clamped to a diode when VIN is larger than VCCIO.
6.
High current I/Os has three sysI/O buffers connected together.
7.
The iCE40LP640 and iCE40LP1K SWG16 package has CDONE and a sysI/O buffer are connected together.
4.7. Static Supply Current – LP Devices
Table 4.6. Supply Current– LP Devices1, 2, 3, 4
Symbol
Parameter
Device
Typ VCC4
Unit
ICC
Core Power Supply
iCE40LP384
21
µA
iCE40LP640
100
µA
iCE40LP1K
100
µA
iCE40LP4K
250
µA
iCE40LP8K
250
µA
ICCPLL5, 6
PLL Power Supply
All devices
0.5
µA
IPP_2V5
NVCM Power Supply
All devices
1.0
µA
ICCIO, ICC_SPI
Bank Power Supply4
VCCIO = 2.5 V
All devices
3.5
µA
Notes:
1.
Assumes blank pattern with the following characteristics: all outputs are tri-stated, all inputs are configured as LVCMOS and
held at VCCIO or GND, on-chip PLL is off. For more detail with your specific design, use the Power Calculator tool. Power specified
with master SPI configuration mode. Other modes may be up to 25% higher.
2.
Frequency = 0 MHz.
3.
TJ = 25 °C, power supplies at nominal voltage.
4.
Does not include pull-up.
5.
No PLL available on the iCE40LP384 and iCE40LP640 device.
6.
VCCPLL is tied to VCC internally in packages without PLL pins.



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