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ICE40 Datasheet(PDF) 18 Page - Lattice Semiconductor |
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ICE40 Datasheet(HTML) 18 Page - Lattice Semiconductor |
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18 / 52 page ![]() iCE40 LP/HX Family Data Sheet © 2011-2018 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 18 FPGA-DS-02029-3.5 3.1.8. Non-Volatile Configuration Memory All iCE40 LP/HX devices provide a Non-Volatile Configuration Memory (NVCM) block which can be used to configure the device. For more information on the NVCM, refer to iCE40 Programming and Configuration (FPGA-TN-02001). 3.1.9. Power On Reset iCE40 LP/HX devices have power-on reset circuitry to monitor VCC, VCCIO_2, VPP_2V5, and VCC_SPI voltage levels during power-up and operation. At power-up, the POR circuitry monitors VCC, VCCIO_2, VPP_2V5, and VCC_SPI (controls configuration) voltage levels. It then triggers download from the on-chip NVCM or external Flash memory after reaching the power-up levels specified in the Power-On-Reset Voltage table in the DC and Switching Characteristics section of this data sheet. Before and during configuration, the I/Os are held in tri-state. I/Os are released to user functionality once the device has finished configuration. 3.2. Programming and Configuration This section describes the programming and configuration of the iCE40 LP/HX family. Device Programming The NVCM memory can be programmed through the SPI port. Device Configuration There are various ways to configure the Configuration RAM (CRAM) including: Internal NVCM Download From an SPI Flash (Master SPI mode) System microprocessor to drive a Serial Slave SPI port (SSPI mode) The image to configure the CRAM can be selected by the user on power up (Cold Boot) or once powered up (Warm Boot). For more details on configuring the iCE40 LP/HX device, refer to iCE40 Programming and Configuration (FPGA-TN- 02001). 3.2.1. Power Saving Options iCE40 LP/HX devices are available in two options for maximum flexibility: LP and HX devices. The LP devices have ultra low static and dynamic power consumption. HX devices are designed to provide high performance. Both the LP and the HX devices operate at 1.2 V VCC. iCE40 LP/HX devices feature iCEGate and PLL low power mode to allow users to meet the static and dynamic power requirements of their applications. While these features are available in both device types, these features are mainly intended for use with iCE40 LP devices to manage power consumption. Table 3.9. Power Saving Features Description Device Subsystem Feature Description PLL When LATCHINPUTVALUE is enabled, puts the PLL into low-power mode; PLL output held static at last input clock value. iCEGate To save power, the optional iCEGate latch can selectively freeze the state of individual, non-registered inputs within an I/O bank. Registered inputs are effectively frozen by their associated clock or clock- enable control. |
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