TPS25751D datasheet(66/89 Pages) TI1

66 / 89 page

I2Cc_SDA/SCL/IRQ (pins 8, 9, and 10) and I2Ct_SCL/SDA/IRQ (pins 16, 17, and 18)

Minimize trace width changes to avoid I2C communication issues.

ADCIN1 and ADCIN2 (pins 2 and 3)

Keep the ADCINx traces away from switching elements. If a resistor divider is used, place the divider close to

LDO_3V3 or LDO_1V5.

GPIO (pins 5, 6, 7, 19, 26, 27, 37, 36, and 13)

Separate GPIO traces running in parallel by a trace width. Keep the GPIOx traces away from switching

elements.

9.4.1.2.2.6 TPS25751D DRAIN

The DRAIN pad is used to dissipate heat for the internal high voltage power path (PPHV). Connect the Drain

pins (pins 15 and 30) to the Drain pad underneath the TPS25751D device. Connect the through hole vias from

the drain pad on the top layer to a copper pour on the bottom layer to help dissipate heat. Additional vias can be

added to improve thermal dissipation.

9.4.1.2.2.7 TPS25751D GND

The GND pad is used to dissipate heat for the TPS25751D device. Connect the GND pins (pins 11, 12, 14 and

31) to the Ground pad underneath the TPS25751D device. Connect the through hole vias from the ground pad

on the top layer to a copper pour on the bottom layer to help dissipate heat. Additional vias can be added to

improve thermal dissipation.

TPS25751

SLVSH93 – OCTOBER 2023

www.ti.com

Submit Document Feedback

Product Folder Links: TPS25751

TPS25751D Datasheet(PDF) 66 Page - Texas Instruments