| Electronic Components Datasheet Search |
|
TPS25751D Datasheet(PDF) 78 Page - Texas Instruments |
|
|
|||||||||||||||||||||||||||||
TPS25751D Datasheet(HTML) 78 Page - Texas Instruments |
|
78 / 89 page ![]() www.ti.com EXAMPLE BOARD LAYOUT 0.05 MIN ALL AROUND 0.05 MAX ALL AROUND 32X (0.2) 32X (0.55) ( 0.2) TYP VIA 28X (0.4) (3.85) (3.85) ( 2.8) (R0.05) TYP (1.15) (1.15) VQFN - 1 mm max height RSM0032B PLASTIC QUAD FLATPACK - NO LEAD 4219108/A 11/2017 SYMM 1 8 9 16 17 24 25 32 SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:20X 33 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METAL SOLDER MASK OPENING NON SOLDER MASK SOLDER MASK DETAILS DEFINED (PREFERRED) EXPOSED METAL TPS25751 SLVSH93 – OCTOBER 2023 www.ti.com 78 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TPS25751 |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |