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TPS25751D Datasheet(PDF) 10 Page - Texas Instruments |
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TPS25751D Datasheet(HTML) 10 Page - Texas Instruments |
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10 / 89 page ![]() 6.5 Thermal Information 6.5.1 TPS25751D - Thermal Information THERMAL METRIC(1) TPS25751D UNIT QFN 38 PINS RθJA Junction-to-ambient thermal resistance (sinking through PP_HV) 57.4 °C/W Junction-to-ambient thermal resistance (sourcing through PP_5V) 46.5 °C/W RθJC (top) Junction-to-case (top) thermal resistance (sinking through PP_HV) 30.5 °C/W Junction-to-case (top) thermal resistance (sourcing through PP_5V) 20.3 °C/W RθJB Junction-to-board thermal resistance (sinking through PP_HV) 21.1 °C/W Junction-to-board thermal resistance (sourcing through PP_5V) 11.1 °C/W ψJT Junction-to-top characterization parameter (sinking through PP_HV) 18.2 °C/W Junction-to-top characterization parameter (sourcing through PP_5V) 1.0 °C/W ψJB Junction-to-board characterization parameter (sinking through PP_HV) 21.1 °C/W Junction-to-board characterization parameter (sourcing through PP_5V) 11.1 °C/W RθJC (bot_GND) Junction-to-case (bottom GND pad) thermal resistance 1.8 °C/W RθJC (bot_DRAIN) Junction-to-case (bottom DRAIN pad) thermal resistance 4.6 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.5.2 TPS25751S - Thermal Information THERMAL METRIC(1) TPS25751S UNIT QFN 32 PINS RθJA Junction-to-ambient thermal resistance 30.5 °C/W RθJC (top) Junction-to-case (top) thermal resistance 24.5 °C/W RθJC Junction-to-board (bottom) thermal resistance 2 °C/W RθJB Junction-to-board thermal resistance 9.8 °C/W ψJT Junction-to-top characterization parameter 0.2 °C/W ψJB Junction-to-board characterization parameter 9.7 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. TPS25751 SLVSH93 – OCTOBER 2023 www.ti.com 10 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TPS25751 |
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