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TPS25751D Datasheet(PDF) 10 Page - Texas Instruments

Part # TPS25751D
Description  TPS25751 USB Type-C® and USB PD Controller with Integrated Power Switches Optimized for Power Applications
PDF  89 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TPS25751D Datasheet(HTML) 10 Page - Texas Instruments

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6.5 Thermal Information
6.5.1 TPS25751D - Thermal Information
THERMAL METRIC(1)
TPS25751D
UNIT
QFN
38 PINS
RθJA
Junction-to-ambient thermal resistance
(sinking through PP_HV)
57.4
°C/W
Junction-to-ambient thermal resistance
(sourcing through PP_5V)
46.5
°C/W
RθJC (top)
Junction-to-case (top) thermal resistance
(sinking through PP_HV)
30.5
°C/W
Junction-to-case (top) thermal resistance
(sourcing through PP_5V)
20.3
°C/W
RθJB
Junction-to-board thermal resistance
(sinking through PP_HV)
21.1
°C/W
Junction-to-board thermal resistance
(sourcing through PP_5V)
11.1
°C/W
ψJT
Junction-to-top characterization parameter
(sinking through PP_HV)
18.2
°C/W
Junction-to-top characterization parameter
(sourcing through PP_5V)
1.0
°C/W
ψJB
Junction-to-board characterization
parameter (sinking through PP_HV)
21.1
°C/W
Junction-to-board characterization
parameter (sourcing through PP_5V)
11.1
°C/W
RθJC (bot_GND)
Junction-to-case (bottom GND pad)
thermal resistance
1.8
°C/W
RθJC (bot_DRAIN)
Junction-to-case (bottom DRAIN pad)
thermal resistance
4.6
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5.2 TPS25751S - Thermal Information
THERMAL METRIC(1)
TPS25751S
UNIT
QFN
32 PINS
RθJA
Junction-to-ambient thermal resistance
30.5
°C/W
RθJC (top)
Junction-to-case (top) thermal resistance
24.5
°C/W
RθJC
Junction-to-board (bottom) thermal
resistance
2
°C/W
RθJB
Junction-to-board thermal resistance
9.8
°C/W
ψJT
Junction-to-top characterization parameter
0.2
°C/W
ψJB
Junction-to-board characterization
parameter
9.7
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
TPS25751
SLVSH93 – OCTOBER 2023
www.ti.com
10
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Copyright © 2023 Texas Instruments Incorporated
Product Folder Links: TPS25751



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