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TMPR3911 Datasheet(PDF) 140 Page - Toshiba Semiconductor |
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TMPR3911 Datasheet(HTML) 140 Page - Toshiba Semiconductor |
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140 / 462 page ![]() Chapter 4 BIU Module 4-40 Figure 4.6.5 DRAM Memory Connection (Big Endian)* *1 Note that Pin No. in the figure above are those of TMPR3912AU-92 (LQFP208). In case of TMPR3911BU (LQFP176), TMPR3911BXB (FBGA177) and TMPR3912XB-92 (FBGA217), refer to the table in the Section 2. TMPR3911/12 A[12:0] CAS1* CAS2* CAS0* CAS3* D[15:8] WE* D[7:0] Pin No. 171,...189 195 A12-0 WE RAS* CAS*MH CAS*LO CAS*HI D15-8 CAS*ML D7-0 197 198 Bank1: 32-bit DRAM 199 194 27,...16 14,...2 D[23:16] A[12:0] D[31:24] WE* RAS1* CAS1* CAS2* CAS0* CAS3* D[15:8] RAS0* D[7:0] A12-0 D15-8 RAS*LO RAS* CAS*HI WE* D7-0 Bank0: 16-bit DRAM A[12:0] RAS0* CAS0* CAS1* D[7:0] WE* D[15:8] D[31:24] D[23:16] RAS1* RAS0* D31-24 D23-16 133,...145 146,...159 193 169 *1 |
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