ADS5295IPFP datasheet(2/93 Pages) TI2

2 / 93 page

ADS5295

SBAS595 – DECEMBER 2012

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION(1)

SPECIFIED TEMPERATURE

PRODUCT

PACKAGE-LEAD

PACKAGE DESIGNATOR

RANGE

PACKAGE MARKING

ORDERING NUMBER

ADS5295

TQFP-80

PFP

–40°C to +85°C

ADS5295

ADS5295IPFP

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

PARAMETER

VALUE

UNIT

AVDD

–0.3 to 2.2

Supply voltage range

LVDD

–0.3 to 2.2

AGND and LGND

–0.3 to 0.3

Voltage between

AVDD to LVDD (when AVDD leads LVDD)

0 to 2.2

LVDD to AVDD (when LVDD leads AVDD)

0 to 2.2

INP, INN

–0.3 to min (2.2, AVDD + 0.3)

RESET, SCLK, SDATA, CS, PD, SYNC,

Voltage applied to

–0.3 to min (2.2, AVDD + 0.3)

CLKP, CLKN(2)

Digital outputs

–0.3 to min (2.2, LVDD + 0.3)

Operating free-air, TA

–40 to +85

°C

Temperature range

Operating junction, TJ

+105

°C

Storage, Tstg

–55 to +150

°C

Electrostatic discharge (ESD) rating

Human body model (HBM)

2000

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2)

When AVDD is turned off, TI recommends switching off the input clock (or ensuring the voltage on CLKP and CLKN is less than |0.3 V|.

This setting prevents the ESD protection diodes at the clock input pins from turning on.

THERMAL INFORMATION

ADS5295

THERMAL METRIC(1)

PFP (TQFP)

UNITS

80 PINS

θJA

Junction-to-ambient thermal resistance

30.8

θJCtop

Junction-to-case (top) thermal resistance

6.3

θJB

Junction-to-board thermal resistance

8.3

°C/W

ψJT

Junction-to-top characterization parameter

0.2

ψJB

Junction-to-board characterization parameter

8.2

θJCbot

Junction-to-case (bottom) thermal resistance

0.3

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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