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28F128 Datasheet(PDF) 45 Page - Intel Corporation

Part # 28F128
Description  3 Volt Intel StrataFlash Memory
PDF  58 Pages
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Manufacturer  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation

28F128 Datasheet(HTML) 45 Page - Intel Corporation

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28F128J3A, 28F640J3A, 28F320J3A
Preliminary
39
5.4
Input Signal Transitions - Reducing Overshoots and
Undershoots When Using Buffers or Transceivers
As faster, high-drive devices such as transceivers or buffers drive input signals to flash memory
devices, overshoots and undershoots can sometimes cause input signals to exceed flash memory
specifications. (See “Absolute Maximum Ratings” on page 40.) Many buffer/transceiver vendors
now carry bus-interface devices with internal output-damping resistors or reduced-drive outputs.
Internal output-damping resistors diminish the nominal output drive currents, while still leaving
sufficient drive capability for most applications. These internal output-damping resistors help
reduce unnecessary overshoots and undershoots. Transceivers or buffers with balanced- or light-
drive outputs also reduce overshoots and undershoots by diminishing output-drive currents. When
considering a buffer/transceiver interface design to flash, devices with internal output-damping
resistors or reduced-drive outputs should be used to minimize overshoots and undershoots. For
additional information, please refer to the AP-647 5 Volt Intel StrataFlash™ Memory Design
Guide.
5.5
VCC, VPEN, RP# Transitions
Block erase, program, and lock-bit configuration are not guaranteed if VPEN or VCC falls outside of
the specified operating ranges, or RP#
≠ V
IH. If RP# transitions to VIL during block erase,
program, or lock-bit configuration, STS (in default mode) will remain low for a maximum time of
tPLPH + tPHRH until the reset operation is complete. Then, the operation will abort and the device
will enter reset/power-down mode. The aborted operation may leave data partially corrupted after
programming, or partially altered after an erase or lock-bit configuration. Therefore, block erase
and lock-bit configuration commands must be repeated after normal operation is restored. Device
power-off or RP# = VIL clears the status register.
The CUI latches commands issued by system software and is not altered by VPEN, CE0, CE1, or
CE2 transitions, or WSM actions. Its state is read array mode upon power-up, after exit from reset/
power-down mode, or after VCC transitions below VLKO. VCC must be kept at or above VPEN
during VCC transitions.
After block erase, program, or lock-bit configuration, even after VPEN transitions down to VPENLK,
the CUI must be placed in read array mode via the Read Array command if subsequent access to
the memory array is desired. VPEN must be kept at or below VCC during VPEN transitions.
5.6
Power-Up/Down Protection
The device is designed to offer protection against accidental block erasure, programming, or lock-
bit configuration during power transitions. Internal circuitry resets the CUI to read array mode at
power-up.
A system designer must guard against spurious writes for VCC voltages above VLKO when VPEN is
active. Since WE# must be low and the device enabled (see Table 2) for a command write, driving
WE# to VIH or disabling the device will inhibit writes. The CUI’s two-step command sequence
architecture provides added protection against data alteration.
Keeping VPEN below VPENLK prevents inadvertent data alteration. In-system block lock and
unlock capability protects the device against inadvertent programming. The device is disabled
while RP# = VIL regardless of its control inputs.



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