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AM3874 Datasheet(PDF) 284 Page - Texas Instruments |
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AM3874 Datasheet(HTML) 284 Page - Texas Instruments |
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284 / 361 page ![]() A1 A1 A1 A1 DDR2 Device AM3874, AM3871 SPRS695C – SEPTEMBER 2011 – REVISED DECEMBER 2013 www.ti.com 8.13.4.1.1.5 DDR2 Keepout Region The region of the PCB used for the DDR2 circuitry must be isolated from other signals. The DDR2 keepout region is defined for this purpose and is shown in Figure 8-50. The size of this region varies with the placement and DDR routing. Additional clearances required for the keepout region are shown in Table 8-57. Figure 8-50. DDR2 Keepout Region NOTE The region shown in should encompass all the DDR2 circuitry and varies depending on placement. Non-DDR2 signals should not be routed on the DDR signal layers within the DDR2 keepout region. Non-DDR2 signals may be routed in the region, provided t hey are routed on layers separated from DDR2 signal layers by a ground layer. No breaks should be allowed in the reference ground layers in this region. In addition, the 1.8-V power plane should cover the entire keepout region. Routes for the two DDR interfaces must be separated by at least 4x; the more separation, the better. 8.13.4.1.1.6 Bulk Bypass Capacitors Bulk bypass capacitors are required for moderate speed bypassing of the DDR2 and other circuitry. Table 8-58 contains the minimum numbers and capacitance required for the bulk bypass capacitors. Note that this table only covers the bypass needs of the DDR2 interfaces and DDR2 device. Additional bulk bypass capacitance may be needed for other circuitry. Table 8-58. Bulk Bypass Capacitors No. Parameter Min Max Unit 1 DVDD18 bulk bypass capacitor count(1) 6 Devices 2 DVDD18 bulk bypass total capacitance 60 μF 3 DDR#1 bulk bypass capacitor count(1) 1 Devices 4 DDR#1 bulk bypass total capacitance(1) 10 μF 5 DDR#2 bulk bypass capacitor count(2) 1 Devices 6 DDR#2 bulk bypass total capacitance(1)(2) 10 μF (1) These devices should be placed near the device they are bypassing, but preference should be given to the placement of the high-speed (HS) bypass capacitors. Use half of these capacitors for DDR[0] and half for DDR[1]. (2) Only used on 32-bit wide DDR2 memory systems. 284 Peripheral Information and Timings Copyright © 2011–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3874 AM3871 |
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