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LTC4449 Datasheet(PDF) 42 Page - Linear Technology |
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LTC4449 Datasheet(HTML) 42 Page - Linear Technology |
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42 / 108 page ![]() LTC3882-1 42 Rev A For more information www.analog.com APPLICATIONS INFORMATION Efficiency Considerations Normally, one of the primary goals of any LTC3882-1 ap- plication will be to obtain the highest practical conversion efficiency. The efficiency of a switching regulator is equal to the output power divided by the input power. It is often useful to analyze individual losses to determine what is limitingtheefficiencyandtoascertainwhichchangewould producethemostimprovement.Balancingorlimitingthese individual losses plays a dominant role in the component selection process outlined over the next few sections. Percent efficiency can be expressed as: %Efficiency = 100% – (L1 + L2 + L3 + …) where L1, L2, et al, are the individual losses as a percent- age of input power: 100 • PLn /PIN. Although all dissipative elements in the system produce losses, four main sources usually account for most of the losses in LTC3882-1 applications: IC supply current, I2R losses, topside power MOSFET transition losses and total gate drive current. 1. The LTC3882-1 IC supply current is a DC value given in the Electrical Characteristics table. The absolute loss created by the IC itself is approximately this current timestheVCCsupplyvoltage.ICsupplycurrenttypically results in a small loss (<0.1%). 2. I2R losses occur mainly in the DC resistances of the MOSFET, inductor, PCB routing, and input and output capacitor ESR. Since each MOSFET is only on for part of the cycle, its on-resistance is effectively multiplied by the percentage of the cycle it is on. Therefore the bot- tom MOSFET should have a much lower on-resistance RDS(ON) than the top MOSFET in high step-down ratio applications. It is crucial that careful attention is paid to the layout of the power path on the PCB to minimize its resistance. In a 2-phase 1.2V system, 1mΩ of PCB resistance at the output costs 5% in efficiency with the output running at 60A. 3. Transition losses apply only to the topside MOSFET and becomesignificantwhenoperatingathighinputvoltages (typically above 12V). This loss can be minimized by choosing a driver with very low drive resistance and a MOSFET with low gate charge QG, gate resistance RG andMillercapacitanceCMILLER.Absolutetransitionloss can be estimated by: PTRANS = (1.7) • VIN2 • IOUT • CMILLER • fPWM 4. Gate drive current is equal to the sum of the top and bot- tomMOSFETgatechargesmultipliedbythefrequencyof operation. These charges are based on the gate voltage applied by the FET driver and can be determined from manufacturer curves like the one shown in Figure 21 . Many driver ICs employ asymmetrical gate voltages for top and bottom FETs. Other sources of loss include body or Schottky diode conduction during the driver dependent non-overlap time and inductor core losses. These latter categories generally account for less than 2% total additional loss. PWM Frequency and Inductor Selection TheselectionofthePWMswitchingfrequencyisatrade-off betweenefficiency,transientresponseandcomponentsize. High frequency operation reduces the size of the inductor and output capacitor as well as increasing the maximum practical control loop bandwidth. However, efficiency is generally lower due to increased transition and switch- ing losses. The inductor value is related to the switching frequency fPWM and step-down ratio. It should be selected to meet choke ripple current requirements. The inductor value can be calculated using the following equation: L = VOUT f PWM • ΔIL ⎛ ⎝⎜ ⎞ ⎠⎟ • 1– VOUT VIN ⎛ ⎝⎜ ⎞ ⎠⎟ Allowing a larger value of choke ripple current (∆IL) leads to smaller L, but results in greater core loss and higher output voltage ripple for a given output capacitance and/ or ESR. A reasonable starting point for setting the ripple current is 30% of the maximum output current. The inductor saturation current rating needs to be higher thanthepeakinductorcurrentduringtransientconditions. If IOUT is the maximum rated load current, then the maxi- mum transient current IMAX would normally be chosen to be some factor greater than IOUT (e.g., 1.6 • IOUT). |
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