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DP83261 Datasheet(PDF) 113 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # DP83261
Description  BMAC Device (FDDI Media Access Controller)
PDF  132 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

DP83261 Datasheet(HTML) 113 Page - National Semiconductor (TI)

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80 Electrical Characteristics
81 ABSOLUTE MAXIMUM RATINGS
If MilitaryAerospace specified devices are required please contact the National Semiconductor Sales Office
Distributors for availability and specifications
Symbol
Parameter
Conditions
Min
Max
Units
VCC
Supply Voltage
b
05
70
V
VIN
DC Input Voltage
b
05
VCC a 05
V
VOUT
DC Output Voltage
b
05
VCC a 05
V
TSTG
Storage Temperature Range
b
65
a
150
C
TL
Lead Temperature
Soldering 10 sec
230
C
(IR or Vapor) (Phase Reflow)
ESD Rating
RZAP e 15k
800
V
CZAP e 120 pF
82 RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Conditions
Min
Max
Units
VCC
Supply Voltage
475
525
V
PD
Power Dissipation
400
mW
T
Operating Temp
0
70
C
83 DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Conditions
Min
Max
Units
VOH1
Minimum High Level
CL e 50 pF
VCC b 05
V
Output Voltage
VOH2
Minimum High Level
IOH eb2mA
24
V
Output Voltage
VOL1
Maximum Low Level
CL e 50 pF
04
V
Output Voltage
VOL2
Maximum Low Level
IOL e 4mA
04
V
Output Voltage
VOL3
Maximum Low Level
IOL e 8mA
Output Voltage INT
04
V
and ACK (Open Drain)
VIH
Minimum High Level
20
V
Input Voltage
VIL
Maximum Low Level
08
V
Input Voltage
IIH
Input High Current
a
10
m
A
IIL
Input Low Current
b
10
m
A
IOZ1
TRI-STATE Leakage for
g
10
m
A
CBD(7 – 0) and CBP
IOZ2
TRI-STATE Leakage for
g
10
m
A
INT and ACK (Open Drain)
IOZ3
Dynamic Supply Current
CL e 50 pF 125 MHZ
70m
mA
113



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