GC5316 datasheet(70/75 Pages) TI

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GC5316

SLWS154A − JANUARY 2004 − REVISED MARCH 2004

www.ti.com

Specifications

7.1

Absolute Maximum Ratings

PARAMETER

SYMBOL

MIN

MAX

UNITS

Pad ring supply voltage

VPAD

−0.3

Core supply voltage

VCORE

−0.3

1.8

Input voltage (undershoot and overshoot)

VIN

−0.5

VPAD+0.5

Clamp current for an input or output

−20

Storage temperature

Tstg

−65

140

Junction temperature

105

Lead soldering temperature (10 seconds)

300

ESD classification

Class 2 (Passed 2.5-kV HBM, 500-V CDM, 150-V MM)

Moisture sensitivity

Class 4 (4 days floor life at 30

°C/60%H)

Reflow conditions

JEDEC standard, 240

°C max

CAUTION:Exceeding the absolute maximum ratings (min or max) may cause permanent damage to the part. These

are stress only ratings and are not intended for operation.

7.2

Recommended Operating Conditions

PARAMETER

MIN

MAX

UNITS

Pad ring supply voltage, VPAD

3.6

Core supply voltage, VCORE

1.5

1.65

Supply voltage difference VPAD – VCORE

Temperature ambient, no air flow(1), TA

−40

°C

Junction temperature(2), TJ

105

°C

(1) Chips specifications in Tables 6.4 and 6.5 are production tested to100°C case temperature. QA tests are performed at 85°C.

(2) Thermal management will be required for full rate operation, see the following table and Section 7.4. The circuit is designed for junction temperatures

up to 125

°C. Sustained operation at elevated temperatures reduces long-term reliability. Lifetime calculations based on maximum junction temperature

of 105

°C.

7.3

Thermal Characteristics

THERMAL CONDUCTIVITY

388 BGA

UNITS

3 W

Theta junction-to-ambient (still air),

θJA

13.5

°C/W

Theta junction-to-ambient (2m/s estimated),

θJA2m

9.3

°C/W

Theta junction-to-case,

θJC

2.4

°C/W

(3) Air flow reduces θJA and is highly recommended.

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