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GC5316 Datasheet(PDF) 72 Page - Texas Instruments

Part # GC5316
Description  HIGH-DENSITY DIGITAL DOWNCONVERTER AND UPCONVERTER
PDF  75 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

GC5316 Datasheet(HTML) 72 Page - Texas Instruments

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GC5316
SLWS154A − JANUARY 2004 − REVISED MARCH 2004
www.ti.com
72
7.6
AC Characteristics
PARAMETER
MIN
MAX
UNIT
FCK
Clock frequency (adcclk, rxclk, txclk) in selected modes(6)(9)
125
MHz
FCK
Clock frequency (adcclk, rxclk, txclk) unrestricted(6)
80
MHz
tADCKL
tRXCKL
tTXCKL
Clock low period (below VIL) (adcclk, rxclk, txclk)(6)
3
ns
tADCKH
tRXCKH
tTXCKH
Clock high period (above VIH) (adcclk, rxclk, txclk)(6)
3
ns
tr, tf
Clock rise and fall times (VIL to VIH) (adcclk, rxclk, txclk)(8)
2
ns
tsu(TX)
Input setup (txin_[0−11]_[a−b], tx_sync[a−d]) before txclk rises(6)
2.2
ns
tsu(RX)
Input setup (rx_sync[a−d]) before rxclk rises(6)
2.5
ns
tsu(RXB)
Input setup (rxin_[a−d]_[0−15]) before rxclk rises adc_fifo bypassed(6)
0.4
ns
tsu(AD)
Input setup (rxin[a−d]_[0−15]) before adcclk rises adc_fifo active(6)
2.2
ns
th(TX)
Input hold (txin_[0−11]_[a−b], tx_sync[a−d]) after txclk rises(6)
1.1
ns
th(RX)
Input hold (rx_sync[a−d]) after rxclk rises(6)
0.5
ns
th(RXB)
Input hold (rxin[a−d]_[0−15]) after rxclk rises adc_fifo bypassed(6)
3.5
ns
th(AD)
Input hold (rxin[a−d]_[0−15]) after adcclk rises adc_fifo active(6)
1
ns
td(TX)
Data output delay (tx_sync_out_[0−5], tx_iflag, txout_[a−d]_[0−17]) after txclk rises(6)
6.5
ns
td(RX)
Data output delay (rx_sync_out_[0−5], rxout_[0−11] _[a−d]) after rxclk rises(6)
6.5
ns
tOH(TX)
Data output hold (tx_sync_out_[0−5], tx_iflag, txout_[a−d]_[0−17]) after txclk rises(6)
1.5
ns
tOH(RX)
Data output hold (rx_sync_out_[0−5], rxout_[0−11] _[a−d]) after rxclk rises(6)
1.5
ns
FJCK
JTAG clock frequency (tck)(6)
40
MHz
tJCKL
JTAG clock low period (below VIL) (tck)(6)
8
ns
tJCKH
JTAG clock high period (above VIH) (tck)(6)
8
ns
tsu(J)
JTAG input (tdi or tms) setup before tck goes high(6)
2
ns
th(J)
JTAG input (tdi or tms) hold time after tck goes high(6)
9
ns
td(J)
JTAG output (tdo) delay from falling edge of tck(6)
6
ns
tsu(UPA)
Microprocessor address setup to falling edge of controls(6)
2.5
ns
th(UPA)
Microprocessor address hold from rising edge of controls(6)
2
ns
tsu(UPD)
Microprocessor data setup to rising edge of controls during writes(6)
12
ns
th(UPD)
Microprocessor data hold from rising edge of controls during writes(6)
2.6
ns
th
Microprocessor data output hold from rising edge of controls (read)(7)
0
ns
td(UP)
Microprocessor data output delay from falling edge of controls (read)(6)
36
ns
tUPCKL
Microprocessor control low time(6)
30
ns
tUPCKH
Microprocessor control high time(6)
8.4
ns
NOTE: Timing is measured from the respective clock at V
PAD /2 to input or output at VPAD /2. Output loading is a 50-Ω transmission line whose delay is
calibrated out.
(6) Each part is tested at 90°C case temperature for the given specification. Lots are sample tested at −40°C.
(7) Controlled by design and process and not directly tested. Verified on initial part evaluation.
(8) Recommended practice.
(9) Excluding rx_sync_out , rx_sync_out_[1−5], tx_sync_out, tx_sync_out_[1−5]. Resampler active or adcclk < 80 MHz.



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