CLRC663 datasheet(125/177 Pages) NXP

125 / 177 page

NXP Semiconductors

CLRC663

High performance multi-protocol NFC frontend CLRC663 and CLRC663 plus

15 Package outline

15.1 Package outline HVQFN32

0.5

UNIT

0.2

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

5.1

4.9

3.25

2.95

5.1

4.9

3.25

2.95

3.5

0.30

0.18

0.05

0.00

0.05

0.1

DIMENSIONS (mm are the original dimensions)

SOT617-1

MO-220

- - -

0.5

0.3

0.1

0.05

2.5

5 mm

scale

SOT617-1

HVQFN32: plastic thermal enhanced very thin quad flat package; no leads;

32 terminals; body 5 x 5 x 0.85 mm

A(1)

max.

detail X

y1 C

terminal 1

index area

terminal 1

index area

01-08-08

02-10-18

1/2

v M

w M

E(1)

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

D(1)

Figure 37. Package outline SOT-617-1 (HVQFN32)

CLRC663

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 5.3 — 3 January 2024

125 / 177

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