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ADPL76030 Datasheet(PDF) 10 Page - Analog Devices |
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ADPL76030 Datasheet(HTML) 10 Page - Analog Devices |
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10 / 40 page ![]() Data Sheet ADPL76030 analog.com Rev.0 10 of 40 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS Figure 3. PIN CONFIGURATION Table 4. Pin Descriptions PIN NAME DESCRIPTION 1 TG1 Buck Side Top Gate Drive. Drives the gate of buck side top N-channel MOSFET with a voltage swing from SW1 to BST1. 2 LSP Positive Terminal of the Buck Side Inductor Current-Sense Resistor (RSENSE). Ensure accurate current sense with Kelvin connection. 3 LSN Negative Terminal of the Buck Side Inductor Current-Sense Resistor (RSENSE). Ensure accurate current sense with Kelvin connection. 4 VIN Input Supply. The VIN pin must be tied to the power input to determine the buck, buck- boost, or boost operation regions. Locally bypass this pin to ground with a minimum 1 µF ceramic capacitor. 5 INTVCC Internal 5 V Linear Regulator Output. The INTVCC linear regulator is supplied from the VIN pin, and powers the internal control circuitry and gate drivers. Locally bypass this pin to ground with a minimum 4.7 µF ceramic capacitor. 6 EN/UVLO Enable and Undervoltage Lockout. Force the pin below 0.3 V to shut down the part and reduce VIN quiescent current below 2 µA. Force the pin above 1.233 V for normal operation. The accurate 1.220 V falling threshold can be used to program an undervoltage lockout (UVLO) threshold with a resistor divider from VIN to ground. An accurate 2.5 µA pull-down current allows the programming of VIN UVLO hysteresis. If neither function is used, tie this pin directly to VIN. 7 TEST1 Factory Test Pin. This pin is used for testing purpose only and must be directly connected to ground for the part to operate properly. 8 TEST2 Factory Test Pin. This pin is used for testing purposes only and must be tied to VREF for the part to operate properly. 9 10 TOP VIEW 29 GND 11 12 13 28 27 26 25 24 14 23 6 5 4 3 2 1 TG1 TG2 7 17 18 19 20 21 22 16 8 15 VOUT DNC SYNC/SPRD RT VC FB SS LSP LSN VIN INTVCC EN/UVLO TEST1 TEST2 NOTES 1. θJA = 43°C/W, θJC = 3.4°C/W. 2. EXPOSED PAD (PIN 29) IS GND, MUST BE SOLDERED TO PCB. ADPL76030 |
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