ADPL76030 datasheet(12/40 Pages) AD

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Data Sheet

ADPL76030

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Rev.0

12 of 40

synchronization. Tie to INTVCC for 25% triangle spread spectrum above internal

oscillator frequency

DNC

Do not Connect. This pin must be left floating for the part to operate properly.

VOUT

Output Supply. The VOUT pin must be tied to the power output to determine the buck,

buck-boost, or boost operation regions. Locally bypass this pin to ground with a

minimum 1 µF ceramic capacitor.

TG2

Boost Side Top Gate Drive. Drives the gate of boost side top N-Channel MOSFET with a

voltage swing from SW2 to BST2.

SW2

Boost Side Switch Node. The SW2 pin swings from a Schottky diode voltage drop

below ground to VOUT.

BST2

Boost Side Bootstrap Floating Driver Supply. The BST2 pin has an integrated bootstrap

Schottky diode from the INTVCC pin and requires an external bootstrap capacitor to the

SW2 pin. The BST2 pin swings from a diode voltage drop below INTVCC to (VOUT +

INTVCC).

BG2

Boost Side Bottom Gate Drive. Drives the gate of boost side bottom N-channel MOSFET

with a voltage swing from ground to INTVCC.

GND

(Exposed

Pad)

Ground. Solder the exposed pad directly to the ground plane.

BG1

Buck Side Bottom Gate Drive. Drives the gate of buck side bottom N-channel MOSFET

with a voltage swing from ground to INTVCC.

BST1

Buck Side Bootstrap Floating Driver Supply. The BST1 pin has an integrated bootstrap

Schottky diode from the INTVCC pin and requires an external bootstrap capacitor to the

SW1 pin. The BST1 pin swings from a diode voltage drop below INTVCC to (VIN + INTVCC).

SW1

Buck Side Switch Node. The SW1 pin swings from a Schottky diode voltage drop below

ground up to VIN.

ADPL76030 Datasheet(PDF) 12 Page - Analog Devices