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AM3892 Datasheet(PDF) 167 Page - Texas Instruments |
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AM3892 Datasheet(HTML) 167 Page - Texas Instruments |
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167 / 299 page ![]() DDR[0] Keep Out Region Encompasses Entire DDR[0] Routing Area DDR3 Controllers DDR[1] Keep Out Region Encompasses Entire DDR[1] Routing Area AM3894 AM3892 www.ti.com SPRS681A – OCTOBER 2010 – REVISED MARCH 2011 Table 8-19. Placement Specifications NO. PARAMETER MIN MAX UNIT 1 X1(1)(2)(3) 1000 Mils 2 X2(1)(2) 600 Mils 3 Y Offset(1)(2)(3) 1500 Mils 4 DDR3 keepout region 5 Clearance from non-DDR3 signal to DDR3 keepout region(4)(5)(6) 4 w (1) For dimension definitions, see Figure 8-15. (2) Measurements from center of MPU to center of DDR3 device. (3) Minimizing X1 and Y improves timing margins. (4) w is defined as the signal trace width. (5) Non-DDR3 signals allowed within DDR3 keepout region provided they are separated from DDR3 routing layers by a ground plane. (6) Note that DDR3 signals from one DDR3 controller are considered non-DDR3 to the other controller. In other words, keep the two DDR3 interfaces separated by this specification. 8.3.2.7 DDR3 Keepout Region The region of the PCB used for DDR3 circutry must be isolated from other signals. The DDR3 keepout region is defined for this purpose and is shown in Figure 8-16. The size of this region varies with the placement and DDR routing. Additional clearances required for the keepout region are shown in Table 8-19. Non-DDR3 signals should not be routed on the DDR signal layers within the DDR3 keepout region. Non-DDR3 signals may be routed in the region, provided they are routed on layers separated from the DDR signal layers by a ground layer. No breaks should be allowed in the reference ground layers in this region. In addition, the 1.5-V DDR3 power plane should cover the entire keepout region. Also note that the two DDR3 controller's signals should be separated from each other by the specification in Table 8-19, item 5. Figure 8-16. DDR3 Keepout Region 8.3.2.8 Bulk Bypass Capacitors Bulk bypass capacitors are required for moderate speed bypassing of the DDR3 and other circuitry. Table 8-20 contains the minimum numbers and capacitance required for the bulk bypass capacitors. Note that this table only covers the bypass needs of the DDR3 controllers and DDR3 device(s). Additional bulk bypass capacitance may be needed for other circuitry. Also note that Table 8-20 is per DDR3 controller; thus, systems using both controllers have to meet the needs of Table 8-20 twice, once for each controller. Copyright © 2010–2011, Texas Instruments Incorporated Peripheral Information and Timings 167 Submit Documentation Feedback Product Folder Link(s): AM3894 AM3892 |
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