DAC3482 datasheet(6/79 Pages) TI1

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DAC3482

SLAS748A

– MARCH 2011 – REVISED JUNE 2011

www.ti.com

THERMAL INFORMATION

DAC3482

THERMAL METRIC(1)

RKD PACKAGE

UNITS

(88) PINS

Maximum junction temperature

125

°C

θJA

Junction-to-ambient thermal resistance(2)

22.1

θJCtop

Junction-to-case (top) thermal resistance(3)

7.1

θJCbot

Junction-to-case (bottom) thermal resistance(4)

0.6

°C/W

θJB

Junction-to-board thermal resistance(5)

4.7

ψJT

Junction-to-top characterization parameter(6)

0.1

ψJB

Junction-to-board characterization parameter(7)

4.6

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3)

The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific

JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4)

The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific

JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(5)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(6)

The junction-to-top characterization parameter,

ψJT, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining

θJA, using a procedure described in JESD51-2a (sections 6 and 7).

(7)

The junction-to-board characterization parameter,

ψJB, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining

θJA , using a procedure described in JESD51-2a (sections 6 and 7).

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