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WM8998 Datasheet(PDF) 25 Page - Wolfson Microelectronics plc |
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WM8998 Datasheet(HTML) 25 Page - Wolfson Microelectronics plc |
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25 / 307 page  Production Data WM8998 w PD, October 2014, Rev 4.0 25 THERMAL CHARACTERISTICS PARAMETER SYMBOL MIN TYP MAX UNIT Junction-to-ambient thermal resistance ΘJA 33.8 °C/W Junction-to-board thermal resistance ΘJB 10.5 °C/W Junction-to-case thermal resistance ΘJC 0.7 °C/W Junction-to-board thermal characterisation parameter ΨJB 9.4 °C/W Junction-to-top thermal characterisation parameter ΨJT 0.01 °C/W Notes: 1. The Thermal Characteristics data is based on simulated test results, with reference to JEDEC JESD51 standards. 2. The thermal resistance (Θ) parameters describe the thermal behaviour in a standardised measurement environment. 3. The thermal characterisation (Ψ) parameters describe the thermal behaviour in the environment of a typical application. |
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