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LAN9250 Datasheet(PDF) 37 Page - Microchip Technology |
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LAN9250 Datasheet(HTML) 37 Page - Microchip Technology |
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37 / 421 page ![]() 2015 Microchip Technology Inc. DS00001913A-page 37 LAN9250 6.0 CLOCKS, RESETS, AND POWER MANAGEMENT 6.1 Clocks The device provides generation of all system clocks as required by the various sub-modules of the device. The clocking sub-system is comprised of the following: • Crystal Oscillator • PHY PLL 6.1.1 CRYSTAL OSCILLATOR The device requires a fixed-frequency 25 MHz clock source for use by the internal clock oscillator and PLL. This is typ- ically provided by attaching a 25 MHz crystal to the OSCI and OSCO pins as specified in Section 19.7, "Clock Circuit," on page 413. Optionally, this clock can be provided by driving the OSCI input pin with a single-ended 25 MHz clock source. If a single-ended source is selected, the clock input must run continuously for normal device operation. Power savings modes allow for the oscillator or external clock input to be halted. The crystal oscillator can be disabled as describe in Section 6.3.4, "Chip Level Power Management," on page 47. For system level verification, the crystal oscillator output can be enabled onto the IRQ pin. See Section 8.2.9, "Clock Output Test Mode," on page 65. Power for the crystal oscillator is provided by a dedicated regulator or separate input pin. See Section 4.1.2, "1.2 V Crys- tal Oscillator Regulator," on page 28. 6.1.2 PHY PLL The PHY module receives the 25 MHz reference clock and, in addition to its internal clock usage, outputs a main system clock that is used to derive device sub-system clocks. The PHY PLL can be disabled as describe in Section 6.3.4, "Chip Level Power Management," on page 47. The PHY PLL will be disabled only when requested and if the PHY port is in a power down mode. Power for PHY PLL is provided by an external input pin, usually sourced by the device’s 1.2V core regulator. See Section 4.0, "Power Connections," on page 26. Note: Crystal specifications are provided in Table 19-13, “Crystal Specifications,” on page 413. |
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