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DS0128 Datasheet(PDF) 68 Page - Microsemi Corporation |
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DS0128 Datasheet(HTML) 68 Page - Microsemi Corporation |
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68 / 140 page ![]() IGLOO2 FPGA and SmartFusion2 SoC FPGA Microsemi Proprietary and Confidential DS0128 Datasheet Revision 12.0 58 2.3.7.2 B-LVDS Bus LVDS (B-LVDS) specifications extend the existing LVDS standard to high-performance multipoint bus applications. Multidrop and multipoint bus configurations may contain any combination of drivers, receivers, and transceivers. Minimum and Maximum DC/AC Input and Output Levels Specification Table 173 • B-LVDS Recommended DC Operating Conditions Parameter Symbol Min Typ Max Unit Supply voltage VDDI 2.375 2.5 2.625 V Table 174 • B-LVDS DC Input Voltage Specification Parameter Symbol Min Max Unit DC input voltage VI 02.925 V Input current high1 1. See Table 24, page 23. IIH (DC) Input current low1 IIL (DC) Table 175 • B-LVDS DC Output Voltage Specification (for MSIO I/O Bank Only) Parameter Symbol Min Typ Max Unit DC output logic high VOH 1.25 1.425 1.6 V DC output logic low VOL 0.9 1.075 1.25 V Table 176 • B-LVDS DC Differential Voltage Specification Parameter Symbol Min Max Unit Differential output voltage swing (for MSIO I/O bank only) VOD 65 460 mV Output common mode voltage (for MSIO I/O bank only) VOCM 1.1 1.5 V Input common mode voltage VICM 0.05 2.4 V Input differential voltage VID 0.1 VDDI V Table 177 • B-LVDS Minimum and Maximum AC Switching Speed Parameter Symbol Max Unit Conditions Maximum data rate (for MSIO I/O bank) DMAX 500 Mbps AC loading: 2 pF / 100 differential load Table 178 • B-LVDS AC Impedance Specifications Parameter Symbol Typ Unit Termination resistance RT 27 Table 179 • B-LVDS AC Test Parameter Specifications Parameter Symbol Typ Unit Measuring/trip point for data path VTRIP Cross point V Resistance for enable path (TZH, TZL, THZ, TLZ)RENT 2K Capacitive loading for enable path (TZH, TZL, THZ, TLZ) CENT 5pF |
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