CLRC663 datasheet(133/177 Pages) NXP

133 / 177 page

NXP Semiconductors

CLRC663

High performance multi-protocol NFC frontend CLRC663 and CLRC663 plus

18 Packing information

Moisture Sensitivity Level (MSL) evaluation has been performed according to SNW-FQ-225B rev.04/07/07

(JEDEC J-STD-020C).

An MSL corresponds to a certain out-of-bag time (or floor life). If semiconductor packages are removed from

their sealed dry-bags and not soldered within their out-of-bag time, they must be baked prior to reflow soldering,

in order to remove any moisture that might have soaked into the package.

For MSL3:

168h out-of-pack floor life at maximum ambient temperature, conditions < 30°C / 60 % RH.

For MSL2:

• 1 year out-of-pack floor life at maximum ambient temperature, conditions < 30°C / 60 % RH.

For MSL1:

• No out-of-pack floor live spec. required. Conditions: <30°C / 85 % RH.

001aaj740

strap 46 mm from corner

tray

chamfer

PIN 1

chamfer

PIN 1

printed plano box

ESD warning preprinted

barcode label (permanent)

barcode label (peel-off)

QA seal

Hyatt patent preprinted

The straps around the package of

stacked trays inside the plano-box

have sufficient pre-tension to avoid

loosening of the trays.

In the traystack (2 trays)

only ONE tray type* allowed

*one supplier and one revision number.

Figure 45. Packing information 1 tray

CLRC663

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 5.3 — 3 January 2024

133 / 177

CLRC663 Datasheet(PDF) 133 Page - NXP Semiconductors