33910 datasheet(8/90 Pages) FREESCALE

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Analog Integrated Circuit Device Data

Freescale Semiconductor

33910

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

MC33910G5AC/MC3433910G5AC

ESD Capability

AECQ100

Human Body Model - JESD22/A114 (CZAP = 100 pF, RZAP = 1500 Ω)

LIN Pin

all other Pins

Charge Device Model - JESD22/C101 (CZAP = 4.0 pF)

Corner Pins (Pins 1, 8, 9, 16, 17, 24, 25 and 32)

All other Pins (Pins 2-7, 10-15, 18-23, 26-31)

According to LIN Conformance Test Specification / LIN EMC Test

Specification, August 2004 (CZAP = 150 pF, RZAP = 330 Ω)

Contact Discharge, Unpowered

LIN pin with 220 pF

LIN pin without capacitor

VS1/VS2 (100 nF to ground)

L1 input (33 k

Ω serial resistor)

According to IEC 61000-4-2 (CZAP = 150 pF, RZAP = 330 Ω)

Unpowered

LIN pin with 220 pF and without capacitor

VS1/VS2 (100 nF to ground)

L1 input (33 k

Ω serial resistor)

VESD1-1

VESD1-2

VESD1-3

VESD2-1

VESD2-2

VESD3-1

VESD3-2

VESD3-3

VESD3-4

VESD4-1

VESD4-2

VESD4-3

±8.0k

±6.0k

±2000

±750

±500

±20k

±11k

>±12k

±6000

±8000

THERMAL RATINGS

Operating Ambient Temperature (8)

33910

34910

-40 to 125

-40 to 85

°C

Operating Junction Temperature

-40 to 150

°C

Storage Temperature

TSTG

-55 to 150

°C

Thermal Resistance, Junction to Ambient

Natural Convection, Single Layer board (1s)(8), (9)

Natural Convection, Four Layer board (2s2p)(8), (10)

RθJA

°C/W

Thermal Resistance, Junction to Case(11)

RθJC

°C/W

Peak Package Reflow Temperature During Reflow(12), (13)

TPPRT

Note 13

°C

Notes

Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient

temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.

10.

Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.

11.

Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).

12.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

13.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and

enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

Table 3. Maximum Ratings (continued)

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit

33910 Datasheet(PDF) 8 Page - Freescale Semiconductor, Inc

33910 Datasheet(HTML) 8 Page - Freescale Semiconductor, Inc

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