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S25FS256S Datasheet(PDF) 151 Page - SPANSION |
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S25FS256S Datasheet(HTML) 151 Page - SPANSION |
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151 / 154 page ![]() November 6, 2013 S25FS-S_00_04 S25FS-S Family 151 Da ta Shee t (Prelim i nar y ) Ordering Information 13. Ordering Part Number The ordering part number is formed by a valid combination of the following: S25FS 256 S AG M F I 00 1 Packing Type 0 = Tray 1 = Tube 3 = 13” Tape and Reel Model Number (Additional Ordering Options) 00 = SOIC16 / WSON footprint, 64-kB Physical Sector 10 = SOIC8 / WSON, 64-kB Physical Sector 20 = 5x5 ball BGA footprint, 64-kB Physical Sector 30 = 4x6 ball BGA footprint, 64-kB Physical Sector 1D = SOIC8, 64-kB Physical Sector, DDR Temperature Range I = Industrial (–40°C to + 85°C) V = Automotive In-Cabin (–40°C to + 105°C) Package Materials F = Lead (Pb)-free H = Low-Halogen, Lead (Pb)-free Package Type M = 16-pin SOIC / 8-Lead SOIC N = 8-contact WSON 6 x 8 mm / WSON 6 x 5 mm B = 24-ball BGA 6 x 8 mm package, 1.00 mm pitch Speed AG = 133 MHz DS = 80 MHz DDR Device Technology S = 0.065 µm MirrorBit Process Technology Density 128 = 128 Mbit 256 = 256 Mbit Device Family S25FS Spansion Memory 1.8 Volt-only, Serial Peripheral Interface (SPI) Flash Memory |
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