MCP37231 datasheet(30/144 Pages) MICROCHIP

30 / 144 page

MCP37231/21-200 AND MCP37D31/21-200

DS20005322D-page 30

 2014-2016 Microchip Technology Inc.

TABLE 2-4:

TEMPERATURE CHARACTERISTICS

Electrical Specifications: Unless otherwise specified, all parameters apply for TA = -40°C to +85°C, AVDD18 =DVDD18 =1.8V,

AVDD12 =DVDD12 = 1.2V, GND = 0V, SENSE = AVDD12, Single-channel mode, Differential Analog Input (AIN) = Sine wave with

amplitude of -1 dBFS, fIN = 70 MHz, Clock Input = 200 MHz, fS = 200 Msps (ADC Core), Resolution = 16-bit, PLL and decimation

filters are disabled, Output load: CMOS data pin = 10 pF, LVDS = 100

termination, LVDS driver current setting = 3.5 mA, +25°C is

applied for typical value.

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges(1)

Operating Temperature Range

-40

—

+85

°C

Thermal Package Resistances(2)

121L Ball-TFBGA

(8 mm x 8 mm)

Junction-to-Ambient Thermal Resistance

JA

—40.2

—

°C/W

Junction-to-Case Thermal Resistance

JC

—8.4

—

°C/W

124L – VTLA

(9 mm x 9 mm)

Junction-to-Ambient Thermal Resistance

JA

—21

—

°C/W

Junction-to-Case (top) Thermal Resistance

JC

—8.7

—

°C/W

Note 1:

Maximum allowed power-dissipation (PDMAX) = (TJMAX - TA)/JA.

This parameter value is achieved by package simulations.

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