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TDA2EX Datasheet(PDF) 132 Page - Texas Instruments |
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TDA2EX Datasheet(HTML) 132 Page - Texas Instruments |
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132 / 391 page ![]() 132 TDA2EG-17 SPRS969B – AUGUST 2016 – REVISED JUNE 2017 www.ti.com Submit Documentation Feedback Product Folder Links: TDA2EG-17 Specifications Copyright © 2016–2017, Texas Instruments Incorporated Table 5-12. Dual Voltage LVCMOS DC Electrical Characteristics (continued) over operating free-air temperature range (unless otherwise noted) PARAMETER MIN NOM MAX UNIT VOH Output high-level threshold (IOH = 100 µA) VDDS-0.2 V VOL Output low-level threshold (IOL = 100 µA) 0.2 V IDRIVE Pin Drive strength at PAD Voltage = 0.45V or VDDS-0.45V 6 mA IIN Input current at each I/O pin 65 µA IOZ IOZ(IPAD Current) for BIDI cell. This current is contributed by the tristated driver leakage + input current of the Rx + weak pullup/pulldown leakage. PAD is swept from 0 to VDDS and the Max(I(PAD)) is measured and is reported as IOZ 65 µA IIN with pulldown enabled Input current at each I/O pin with weak pulldown enabled measured when PAD = VDDS 40 100 200 µA IIN with pullup enabled Input current at each I/O pin with weak pullup enabled measured when PAD = 0 10 100 290 µA CPAD Pad capacitance (including package capacitance) 4 pF ZO Output impedance (drive strength) 40 Ω (1) VDDS in this table stands for corresponding power supply. For more information on the power supply name and the corresponding ball, see Table 4-1, POWER [10] column. 5.7.1 USBPHY DC Electrical Characteristics NOTE USB1 instance is compliant with the USB3.0 SuperSpeed Transmitter and Receiver Normative Electrical Parameters as defined in the USB3.0 Specification Rev 1.0 dated Jun 6, 2011. NOTE USB1 and USB2 Electrical Characteristics are compliant with USB2.0 Specification Rev 2.0 dated April 27, 2000 including ECNs and Errata as applicable. 5.7.2 HDMIPHY DC Electrical Characteristics NOTE The HDMIPHY DC Electrical Characteristics are compliant with the HDMI 1.4a specification and are not reproduced here. 5.7.3 PCIEPHY DC Electrical Characteristics NOTE The PCIe interfaces are compliant with the electrical parameters specified in PCI Express® Base Specification Revision 3.0. 5.8 Thermal Resistance Characteristics for CBD Package For reliability and operability concerns, the maximum junction temperature of the Device has to be at or below the TJ value identified in Section 5.4, Recommended Operating Conditions. A BCI compact thermal model for this Device is available and recommended for use when modeling thermal performance in a system. |
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