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DS3173N Datasheet(PDF) 2 Page - Dallas Semiconductor |
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DS3173N Datasheet(HTML) 2 Page - Dallas Semiconductor |
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2 / 232 page ![]() DS3171/DS3172/DS3173/DS3174 2 of 230 FEATURES (CONTINUED) § Loopbacks Include Line, Diagnostic, Framer, Payload, and Analog with Capabilities to Insert AIS in the Directions Away from Loopback Directions § Ports can be Disabled to Reduce Power § Integrated Clock Rate Adapter to Generate the Remaining Internally Required 44.736MHz (DS3) and 34.368MHz (E3) from a Single Clock Reference Source at One of Three Standard Frequencies (DS3, E3, STS-1) § Pin Compatible with the DS318x Family of Devices and the DS316x Family of Devices § 8-/16-Bit Generic Microprocessor Interface § Low-Power (~1.73W) 3.3V Operation (5V Tolerant I/O) § Small High-Density Thermally Enhanced Chip- Scale BGA Packaging (TE-CSBGA) with 1.27mm Pin Pitch § Industrial Temperature Operation: -40°C to +85°C § IEEE1149.1 JTAG Test Port DETAILED DESCRIPTION The DS3171 (single), DS3172 (dual), DS3173 (triple), and DS3174 (quad) perform framing, formatting, and line transmission and reception. These devices contain integrated LIU(s), framer/formatter for M23 DS3, C-bit DS3, G.751 E3, G.832 E3, or a combination of the above signal formats. Each LIU has independent receive and transmit paths. The receiver LIU block performs clock and data recovery from a B3ZS- or HDB3-coded AMI signal and monitors for loss of the incoming signal, or can be bypassed for direct clock and data inputs. The receiver LIU block optionally performs B3ZS/HDB3 decoding. The transmitter LIU drives standard pulse-shape waveforms onto 75 W coaxial cable or can be bypassed for direct clock and data outputs. The jitter attenuator can be placed in either transmit or receive data path when the LIU is enabled. The DS3/E3 framers transmit and receive serial data in properly formatted M23 DS3, C-bit DS3, G.751 E3, or G.832 E3 data streams. Unused functions can be powered down to reduce device power. The DS317x DS3/E3 SCTs conform to the telecommunications standards listed in Section 4. |
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