CS47L35 datasheet(297/300 Pages) CIRRUS

297 / 300 page

DS1085F3

297

CS47L35

7 Thermal Characteristics

Notes:

• Natural convection at the maximum recommended operating temperature TA (see Table 3-3)

• Four-layer, 2s2p PCB as specified by JESD51-9 and JESD51-11; dimensions: 101.5 x 114.5 x 1.6 mm

• Thermal parameters as defined by JESD51-12

R2096730

(1FFE5Ah)

DSP3_Ext_window_D

DSP3_

EXT_D_

PSIZE16

000

00000000h

DSP3_EXT_D_PAGE [15:0]

R2096736

(1FFE60h)

DSP3_Identity

000

00000000h

000

DSP3_CORE_NUMBER [4:0]

Table 7-1. Typical JEDEC Four-Layer, 2s2p Board Thermal Characteristics

Parameter

Symbol

WLCSP

Units

Junction-to-ambient thermal resistance

JA

34.5

°C/W

Junction-to-board thermal resistance

JB

7.6

°C/W

Junction-to-case thermal resistance

JC

0.895

°C/W

Junction-to-board thermal-characterization parameter

JB

7.6

°C/W

Junction-to-package-top thermal-characterization parameter

JT

0.075

°C/W

Table 6-2. Register Map Definition—32-bit region (Cont.)

Name

Default

CS47L35 Datasheet(PDF) 297 Page - Cirrus Logic

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