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PCM5142 Datasheet(PDF) 67 Page - Texas Instruments |
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PCM5142 Datasheet(HTML) 67 Page - Texas Instruments |
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67 / 123 page ![]() 1 Top Layer Ground Pour Top Layer Signal Traces Via to bottom Ground Plane Pad to top layer ground pour L-Ch Out Rch Out Make sure to have ground pour separating the Left and Right channel traces to help prevent crosstalk 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 CPVDD CAPP CPGND CAPM VNEG OUTL OUTR AVDD AGND VCOM SDA / MOSI SCL / MC GPIO5 GPIO4 DVDD DGND LDOO XSMT ADR1 /MISO LRCK DIN BCK SCK GPIO6 MODE2 /MS MODE1 ADR2 GPIO3 3.3V 0.1uF 0.1uF Clock signals from DSP or Audio Processor 3.3V Control Signals from Microcontroller Control Signals from Microcontroller Control Signals from Microcontroller Capacitor values unless noted should be 2.2uF COG Ceramics 10uF 10uF PCM5141, PCM5142 www.ti.com SLAS759B – AUGUST 2012 – REVISED JANUARY 2016 11 Layout 11.1 Layout Guidelines • The PCM514x family of devices are simple to layout. Most engineers use a shared common ground for an entire device. GND can consider AGND and DGND connected. • Good system partitioning should keep digital clock and interface traces away from the analog outputs for highest analog performance. This reduces any high-speed clock return currents influencing the analog outputs. • Power supply and charge pump decoupling capacitors should be placed as close as possible to the device. • The top layer should be used for routing signals, whilst the bottom layer can be used for GND. 11.2 Layout Example It is recommended to place a top layer ground pour for shielding around the DAC and connect to lower main PCB ground plane by multiple vias Figure 87. PCM514x Layout Example Copyright © 2012–2016, Texas Instruments Incorporated Submit Documentation Feedback 67 Product Folder Links: PCM5141 PCM5142 |
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