THS4521 datasheet(3/66 Pages) TI2

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5 Pin Configuration and Functions

FB–

FB+

IN+

IN–

OUT–

OUT+

Vocm

Figure 5-1. RGT Package

16-Pin VQFN With Exposed Thermal Pad

(Top View)

IN–

OUT–

OUT+

Vocm

Vs–

Vs+

IN+

Figure 5-2. RUN Package

10-Pin WQFN

(Top View)

Table 5-1. Pin Functions

TYPE

DESCRIPTION

NAME

NO.(1)

FB+

Output

Noninverted (positive) output feedback

FB–

Output

Inverted (negative) output feedback

IN+

Input

Noninverting (positive) amplifier input

IN–

Input

Inverting (negative) amplifier input

—

No internal connection

OUT+

Output

Noninverted (positive) amplifier output

OUT–

Output

Inverted (negative) amplifier output

Input

Power down. PD = logic low = power off mode; PD = logic high = normal operation.

Vocm

Input

Common-mode voltage input

Vs+

5, 6, 7, 8

Input

Positive power-supply input

Vs–

13, 14, 15, 16

Input

Negative power-supply input

(1)

Solder the exposed thermal pad to a heat-spreading power or ground plane. This pad is electrically isolated from the die, but must be

connected to a power or ground plane and not floated.

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THS4541

SLOS375B – AUGUST 2014 – REVISED FEBRUARY 2024

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