ESP32-P4 datasheet(85/93 Pages) ESPRESSIF

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5 Electrical Characteristics

Table 5-7 – cont’d from previous page

Work mode

Frequency

(MHz)

Description

Typ1

(mA)

Typ2

(mA)

Single core running CoreMark instructions, the

other core in idle state

110

Dual core running 32-bit data access instructions

150

200

WAITI (Dual core in idle state)

Dual-core while(1) loop operation

Single core running CoreMark instructions, the

other core in idle state

Dual core running 32-bit data access instructions

100

WAITI (Dual core in idle state)

Dual-core while(1) loop operation

Single core running CoreMark instructions, the

other core in idle state

Dual core running 32-bit data access instructions

WAITI (Dual core in idle state)

Dual-core while(1) loop operation

Single core running CoreMark instructions, the

other core in idle state

Dual core running 32-bit data access instructions

1 Current consumption when all peripheral clocks are disabled.

2 Current consumption when all peripheral clocks are enabled. In practice, the current consumption

might be different depending on which peripherals are enabled.

3 In Active mode, the current consumption might be higher when accessing flash/PSRAM.

Table 5-8. Current Consumption in Low-Power Modes

Mode

Description

Typ

(mA)1

Light-sleep2

All GPIOs are high-impedance, and all power supplies are enabled 0.8

All GPIOs are high-impedance, most of peripherals are disabled,

and chip is connected through USB

0.085

All peripherals are disabled, and data is stored in HP memory

0.075

Deep-sleep

LP timer and LP memory are powered on

0.012

Power off

CHIP_PU is set to low level, the chip is powered off

0.001

1 The power consumption data was measured with USB 2.0 not working.

2 The current in Light-sleep mode refers to the current measured when the PSRAM is not

powered. In Light-sleep mode, if the PSRAM is powered on, the chip’s internal current

increases by about 0.1 mA, in addition to the current required for the PSRAM’s operating

mode.

5.7

Memory Specifications

The data below is sourced from the memory vendor datasheet. These values are guaranteed through design

and/or characterization but are not fully tested in production. Devices are shipped with the memory

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