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RC522 Datasheet(PDF) 85 Page - NXP Semiconductors |
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RC522 Datasheet(HTML) 85 Page - NXP Semiconductors |
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85 / 96 page ![]() MFRC522_34 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet PUBLIC Rev. 3.4 — 5 March 2010 112134 85 of 96 NXP Semiconductors MFRC522 Contactless reader IC 17. Package outline Fig 33. Package outline SOT617-1 (HVQFN32) 0.5 1 A1 Eh b UNIT y e 0.2 c REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 5.1 4.9 Dh 3.25 2.95 y1 5.1 4.9 3.25 2.95 e1 3.5 e2 3.5 0.30 0.18 0.05 0.00 0.05 0.1 DIMENSIONS (mm are the original dimensions) SOT617-1 MO-220 - - - - - - 0.5 0.3 L 0.1 v 0.05 w 0 2.5 5 mm scale SOT617-1 HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A(1) max. A A1 c detail X y y1 C e L Eh Dh e e1 b 916 32 25 24 17 8 1 X D E C B A e2 terminal 1 index area terminal 1 index area 01-08-08 02-10-18 1/2 e 1/2 e A C C B v M w M E(1) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. D(1) |
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