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TMS28F033 Datasheet(PDF) 49 Page - Texas Instruments |
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TMS28F033 Datasheet(HTML) 49 Page - Texas Instruments |
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49 / 52 page ![]() XXXXXh 18 11 12 13 14 15 16 17 6 4 3 5 78 9 12 10 XXXXXh VPPH VPPL Hi-Z FFh BBA CLK A–1–A16 (word-wide) A0–A16 (doble-word-wide) E Asynchronous WE WR D0h or 0Dh 20h or 02h Hi-Z BAA LBA OE RY/BY QV Hi-Z DQ0–DQ7 and DQ24–DQ31 (word-wide) DQ0–DQ31 (double-word-wide) VPP RP Valid SR tWHYH3, 4 Write Erase-Setup Command Write Erase-Confirm Command Automated Erase Read Status Register Bits Write Read- Array Command BASIC/ENHANCED PIN SET DCR0 OE MODE DCR1 WE MODE DCR2 DIS/WORD DCR3 LRV/BAA DCR4 BURST LENGTH DCR25,24 BURST LATENCY (X) DCR29,28 BURST LATENCY (Y) DCR30 x16 WRITE OPTION DCR31 Basic pin set (DCR0 = 0) 0 1 (see Note D) Optional X (see Note E) XX XX X X Enhanced pin set (DCR0 = 1) 0 1 (see Note D) Optional X (see Note E) XX XX X X NOTES: A. X is a don’t care. BBA is the block base address. B. See Table 8 for DCR setting descriptions. C. For asynchronous erase, the address and command are latched on the WE rising edge. D. For asynchronous erase-cycle timing (DCR2 = 1), see Figure 25. E. For LRV usage (DCR4 = 0), see Figure 8; and for DCR4 = 1, see Figure 9. Figure 26. Asynchronous Erase-Cycle Timing With Device Configuration Register Settings ADVANCE INFORMATION |
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