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TMS28F033 Datasheet(PDF) 13 Page - Texas Instruments |
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TMS28F033 Datasheet(HTML) 13 Page - Texas Instruments |
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13 / 52 page ![]() TMS28F033 4194304-BIT SYNCHRONOUS FLASH MEMORY SMJS833 – NOVEMBER 1997 13 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 device configuration defaults (continued) Table 8. Device Configuration Register Bit Definitions and Functions (Continued) DCR BIT FUNCTION DATA COMMENTS DCR8 – DCR23 Reserved for Texas Instruments (TI ™) and should not be used 0000h DCR25, DCR24 Burst length 00 = MOD4 (default) 01 = MOD8 10 = MOD16 11 = MOD32 (see Note 6) There are four available burst length settings. The MOD4 burst is a modulo burst of four words/double-words for x16/x32, respectively. The other available burst lengths are MOD8, MOD16, and MOD32 (see Table 12). DCR27, DCR26 Reserved for TI and should not be used 00 – (default) (see Note 6) DCR29, DCR28 Burst latency (X) 00 = OE-controlled (default if in x32 mode and when OE is synchronous) 01 = 3 cycles 10 = 4 cycles (default if in x16 mode or when OE is asynchronous) 11 = 5 cycles (see Note 6) The four X latency possibilities are OE-controlled burst, and 3, 4, or 5 clock cycles for BAA-controlled burst. X latency denotes the number of clock cycles required to access the first word from memory (see Table 10 and Table 11). DCR30 Burst latency (Y) 0 = 1 cycle (default) 1 = 2 cycles (see Note 6) The two Y latency possibilities are one clock cycle and two clock cycles. Y latency denotes the number of clock cycles required to access the subsequent words to complete the cache fill (see Table 10 and Table 11). DCR31 One- or two-word write option for x16 mode 0 = Program one word (two -cycle write) (default) 1 = Program two words (three-cycle write) (see Note 6) Applicable for x16 mode only. When DCR31 = 0, only one word (16 bits) is programmed in two cycles for each program command received by the CSM. When DCR31 = 1, two words (32 bits) are programmed in three cycles for each program command received by the CSM (see Table 5). NOTES: 5. The default setting for these bits is set at the factory prior to shipping. 6. These bits return to the default setting after a power-on reset is performed; therefore, it is necessary to program these bits to the desired configuration. control pin functions The DCR0 bit is the control pin configuration bit that selects between the basic or enhanced pin set (see Table 8 and Table 9). With the enhanced pin set (DCR0 = 1), five additional pins are available: chip enable (E), data valid (QV), ready/busy (RY/BY), 3.3-V/5-V IO voltage select (3/5IO), and linear burst order (LBO). With the basic pin set (DCR0 = 0), neither QV nor RY/BY are available, both E and LBO are effectively tied low (VIL), and 3/5IO is effectively tied high (VIH). The DCR1 and DCR2 bits determine the synchronous or asynchronous operation of output enable (OE) and write enable (WE), respectively. DCR3 determines the function of pin 78 as either output disable (DIS) or word enable (WORD) (see the Terminal Functions table). When DCR3 = 0 (for DIS usage) the device is forced into using the 32-bit data bus (see Figure 21). When DCR3 = 1, both the 16-bit and 32-bit data buses are available. The DCR4 bit determines the function of pin 79 as either low-regulator-voltage detection (LRV) or burst-address advance (BAA). TI is a trademark of Texas Instruments Incorporated. |
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