ADXL366 datasheet(12/71 Pages) AD

12 / 71 page

Data Sheet

ADXL366

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 12 of 71

Table 5. Absolute Maximum Ratings

Parameter

Rating

Acceleration (Any Axis, Unpowered)

5000g, 0.1ms pulse width

Acceleration (Any Axis, Powered)

5000g, 0.1ms pulse width

−0.3V to +4.0V

VDDIO

−0.3V to +4.0V

All Other Pins

−0.3V to VDDIO

Output Short-Circuit Duration (Any Pin to

Ground)

Indefinite

Temperature Range (Storage)

−50°C to +150°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Overall thermal performance is directly linked to the printed circuit

board (PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Thermal resistance values specified in Table 6 are simulated based

on JEDEC specifications, unless specified otherwise, and must be

used in compliance with JESD51-12.

θJA is the natural convection, junction to ambient thermal resistance

measured in a one cubic foot sealed enclosure, θJC is the chan-

nel-to-case thermal resistance (channel to exposed metal ground

paddle/pad on the underside of the device), ΨJT refers to the

junction-to-top of package, thermal characterization number, and

ΨJB refers to the junction-to-board thermal characterization number.

Table 6. Thermal Resistance

Package

Type

θJA

θJC

ΨJT

ΨJB

Device

Weight

CC-12-4

177.8°C/W 116.7°C/W 11.1°C/W

127.8°C/W 9.04mg

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Charged device model (CDM) per ANSI/ESDA/JEDEC JS-002.

ESD Ratings for ADXL366

Table 7. ADXL366, 12-Terminal LGA

ESD Model

Withstand Threshold (V)

Class

HBM

2000

CDM

1250

RECOMMENDED SOLDERING PROFILE

Table 8 provides details about the recommended soldering profile.

Figure 16. Recommended Soldering Profile

Table 8. Recommended Soldering Profile

Profile Feature

Condition

Sn63/Pb37

Pb-Free

Average Ramp Rate (TL to TP)

Preheat

3°C/sec max

Minimum Soldering Temperature

(TSMIN)

100°C

150°C

Maximum Soldering Temperature

(TSMAX)

150°C

200°C

Soldering Time (TSMIN to TSMAX)(tS)

60 sec to 120 sec

60 sec to 180 sec

TSMAX to TL Ramp-Up Rate

3°C/sec maximum

Time Maintained Above Liquidous

Temperature (TL)

Liquidous Temperature (TL)

183°C

217°C

Liquidous Time (tL)

60 sec to 150 sec

Peak Temperature (TP)

240 + 0°C/−5°C

260 + 0°C/−5°C

Time Within 5°C of Actual Peak

Temperature (tP)

10 sec to 30 sec

20 sec to 40 sec

Ramp-Down Rate

6°C/sec maximum

Time at 25°C to Peak Temperature

6 minutes

maximum

8 minutes maximum

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

ADXL366 Datasheet(PDF) 12 Page - Analog Devices

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