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AM3892 Datasheet(PDF) 158 Page - Texas Instruments

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Part # AM3892
Description  AM389x Sitara ARM Microprocessors (MPUs)
PDF  299 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

AM3892 Datasheet(HTML) 158 Page - Texas Instruments

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AM3894
AM3892
SPRS681A – OCTOBER 2010 – REVISED MARCH 2011
www.ti.com
8.3.1.2.7 High-Speed Bypass Capacitors
High-speed (HS) bypass capacitors are critical for proper DDR2 interface operation. It is particularly
important to minimize the parasitic series inductance of the HS bypass capacitors, MPU/DDR power, and
MPU/DDR ground connections. Table 8-7 contains the specification for the HS bypass capacitors as well
as for the power connections on the PCB.
Table 8-7. High-Speed Bypass Capacitors
NO.
PARAMETER
MIN
MAX
UNIT
1
HS bypass capacitor package size(1)
0402
10 Mils
2
Distance from HS bypass capacitor to device being bypassed
250
Mils
3
Number of connection vias for each HS bypass capacitor(2)
2
Vias
4
Trace length from bypass capacitor contact to connection via
1
30
Mils
5
Number of connection vias for each MPU power/ground ball
1
Vias
6
Trace length from MPU power/ground ball to connection via
35
Mils
7
Number of connection vias for each DDR2 device power/ground ball
1
Vias
8
Trace length from DDR2 device power/ground ball to connection via
35
Mils
9
DVDD18 HS bypass capacitor count(3)(4)
40
Devices
10
DVDD18 HS bypass capacitor total capacitance(5)
2.4
μF
11
DDR device HS bypass capacitor count(6)(7)
8
Devices
12
DDR device HS bypass capacitor total capacitance(7)
0.4
μF
(1)
LxW, 10-mil units, i.e., a 0402 is a 40x20-mil surface-mount capacitor.
(2)
An additional HS bypass capacitor can share the connection vias only if it is mounted on the opposite side of the board.
(3)
These devices should be placed as close as possible to the device being bypassed.
(4)
Use half of these capacitors for DDR[0] and half for DDR[1].
(5)
Use half of these capacitors for DDR[0] and half for DDR[1].
(6)
These devices should be placed as close as possible to the device being bypassed.
(7)
Per DDR device.
8.3.1.2.8 Net Classes
Table 8-8 lists the clock net classes for the DDR2 interface. Table 8-9 lists the signal net classes, and
associated clock net classes, for the signals in the DDR2 interface. These net classes are used for the
termination and routing rules that follow.
Table 8-8. Clock Net Class Definitions
CLOCK NET CLASS
MPU PIN NAMES
CK
DDR[x]_CLK[x]/DDR[x]_CLK[x]
DQS0
DDR[x]_DQS[0]/DDR[x]_DQS[0]
DQS1
DDR[x]_DQS[1]/DDR[x]_DQS[1]
DQS2(1)
DDR[x]_DQS[2]/DDR[x]_DQS[2]
DQS3(1)
DDR[x]_DQS[3]/DDR[x]_DQS[3]
(1)
Only used on 32-bit wide DDR2 memory systems.
158
Peripheral Information and Timings
Copyright © 2010–2011, Texas Instruments Incorporated
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