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PS081 Datasheet(PDF) 23 Page - ams AG |
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PS081 Datasheet(HTML) 23 Page - ams AG |
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23 / 155 page ![]() acam-messelectronic gmbh - Friedrich-List-Str.4 - D-76297 Stutensee-Blankenloch - Germany - www.acam.de 2-14 1 PSØ81 Dimensions and Pad Opening The exact Die size is 2.37 x 3.47 mm, the Wafer thickness 725µm. The IC is expected to be used predominantly as Chip On Board (COB). Therefore it is essential to have a Pad Opening that is suitab- le for bonding machines: Width: 90µm Height: 116µm Member of the ams Group |
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