LAN9250 datasheet(400/421 Pages) MICROCHIP

400 / 421 page

LAN9250

DS00001913A-page 400

 2015 Microchip Technology Inc.

19.3

Package Thermal Specifications

Note:

Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESDN51.

19.4

Current Consumption and Power Consumption

This section details the device’s typical supply current consumption and power dissipation for 10BASE-T, 100BASE-TX

and power management modes of operation with the internal regulator enabled and disabled.

TABLE 19-1:

64-PIN QFN PACKAGE THERMAL PARAMETERS

Parameter

Symbol

Value

Units

Comments

Thermal Resistance Junction to Ambient

JA

23.6

°C/W

Measured in still air

Thermal Resistance Junction to Bottom of Case

JT

0.1

°C/W

Measured in still air

Thermal Resistance Junction to Top of Case

JC

1.8

°C/W

Airflow 1 m/s

TABLE 19-2:

64-PIN TQFP-EP PACKAGE THERMAL PARAMETERS

Parameter

Symbol

Value

Units

Comments

Thermal Resistance Junction to Ambient

JA

29.0

°C/W

Measured in still air

Thermal Resistance Junction to Bottom of Case

JT

0.3

°C/W

Measured in still air

Thermal Resistance Junction to Top of Case

JC

12.8

°C/W

Airflow 1 m/s

TABLE 19-3:

MAXIMUM POWER DISSIPATION

Mode

Maximum Power (mW)

Internal Regulator Disabled, 2.5 V Ethernet Magnetics

460

Internal Regulator Disabled, 3.3 V Ethernet Magnetics

550

Internal Regulator Enabled, 2.5 V Ethernet Magnetics

617

Internal Regulator Enabled, 3.3 V Ethernet Magnetics

706

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